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Clean, fast and scalable transfer of ultrathin/patterned vertically-aligned carbon nanotube arrays
Ping, LQ; Hou, PX; Wang, H; Chen, ML; Zhao, Y; Cong, HT; Liu, C; Cheng, HM; Liu, C (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
2018-07-01
Source PublicationCARBON
ISSN0008-6223
Volume133Pages:275-282
AbstractThe difficulty of transferring vertically-aligned carbon nanotube (VACNT) arrays onto specific substrates limits their use in many fields, for instance as thermal interface materials or electrical interconnects in microelectronics. Current transfer techniques are either limited by the type and shape of the target substrate, or their inability to transfer patterned and thin VACNT arrays. Here, we report a simple and clean press transfer method that does not use transfer media, and involves only pressing and lifting steps. This method enables not only the transfer of patterned and very thin VACNT arrays but also the tight adhesion of the arrays onto various flat or curved target substrates. Flexible and transparent electrodes were fabricated by transferring inter-digitated VACNT patterns onto a PET substrate. VACNT arrays with a thickness of 20 mu m were transferred onto target substrates cleanly, showing a very low thermal resistance of similar to 26 K mm(2) W-1. The transferred clean, thin VACNT arrays show good heat dissipation as thermal interface material when integrated into a desktop computer CPU cooling system. (C) 2018 Elsevier Ltd. All rights reserved.; The difficulty of transferring vertically-aligned carbon nanotube (VACNT) arrays onto specific substrates limits their use in many fields, for instance as thermal interface materials or electrical interconnects in microelectronics. Current transfer techniques are either limited by the type and shape of the target substrate, or their inability to transfer patterned and thin VACNT arrays. Here, we report a simple and clean press transfer method that does not use transfer media, and involves only pressing and lifting steps. This method enables not only the transfer of patterned and very thin VACNT arrays but also the tight adhesion of the arrays onto various flat or curved target substrates. Flexible and transparent electrodes were fabricated by transferring inter-digitated VACNT patterns onto a PET substrate. VACNT arrays with a thickness of 20 mu m were transferred onto target substrates cleanly, showing a very low thermal resistance of similar to 26 K mm(2) W-1. The transferred clean, thin VACNT arrays show good heat dissipation as thermal interface material when integrated into a desktop computer CPU cooling system. (C) 2018 Elsevier Ltd. All rights reserved.
description.department[ping, linquan ; hou, peng-xiang ; wang, han ; chen, maolin ; zhao, yang ; cong, hongtao ; liu, chang ; cheng, hui-ming] chinese acad sci, inst met res, shenyang 110016, peoples r china ; [ping, linquan ; hou, peng-xiang ; wang, han ; chen, maolin ; zhao, yang ; cong, hongtao ; liu, chang] univ sci & technol china, sch mat sci & engn, hefei 230026, peoples r china ; [cheng, hui-ming] tsinghua univ, tbsi, shenzhen 518055, peoples r china ; [cheng, hui-ming] king abdulaziz univ, cees, jeddah 21589, saudi arabia
KeywordDry Adhesives High-quality Density Growth Temperature Performance Batteries Forests
Subject AreaChemistry, Physical ; Materials Science, Multidisciplinary
Funding OrganizationMinistry of Science and Technology of China [2016YFA0200101]; National Natural Science Foundation of China [51625203, 51532008, 51521091, 51572264, 51772303]; Chinese Academy of Sciences [174321KYSB20160011, KGZD-EW-T06]; CAS/SAFEA International Partnership Program for Creative Research Teams; MOPPI project of the Aalto University AEF Research Program; Liaoning BaiQianWan Talents Program
Indexed BySCI
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/79283
Collection中国科学院金属研究所
Corresponding AuthorHou, PX; Liu, C (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
Recommended Citation
GB/T 7714
Ping, LQ,Hou, PX,Wang, H,et al. Clean, fast and scalable transfer of ultrathin/patterned vertically-aligned carbon nanotube arrays[J]. CARBON,2018,133:275-282.
APA Ping, LQ.,Hou, PX.,Wang, H.,Chen, ML.,Zhao, Y.,...&Liu, C .(2018).Clean, fast and scalable transfer of ultrathin/patterned vertically-aligned carbon nanotube arrays.CARBON,133,275-282.
MLA Ping, LQ,et al."Clean, fast and scalable transfer of ultrathin/patterned vertically-aligned carbon nanotube arrays".CARBON 133(2018):275-282.
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