Stress Study on CrN Thin Films with Different Thicknesses on Stainless Steel

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	Stress Study on CrN Thin Films with Different Thicknesses on Stainless Steel
	Fan, D; Lei, H; Guo, CQ; Qi, DL; Gong, J; Sun, C; Sun, C (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
	2018-03-01
发表期刊	ACTA METALLURGICA SINICA-ENGLISH LETTERS
ISSN	1006-7191
卷号	31 期号:3 页码:329-336
摘要	The reliability of a substrate curvature-based stress measurement method for CrN thin films on substrate with fluctuant surface was discussed. The stress error led by the ignorance of substrate thermal deformation was studied. Results showed that this error could be as large as several hundred MPa under general deposition conditions. Stress in the CrN thin films with different thicknesses ranging from 110 to 330 nm on stainless steel was studied by this method, in comparison with conventional results on silicon wafer. The thin films' morphology and structure were investigated and related to the film stress. A significant result of the comparison is that stress evolution in the thin films on steel obviously differs from that on silicon wafer, not only because the two substrates have different coefficients of thermal expansion, which provokes thermal stress, but also the considerable discrepancy in the thin films' grain coarsening rate and structure that induce different intrinsic stresses.; The reliability of a substrate curvature-based stress measurement method for CrN thin films on substrate with fluctuant surface was discussed. The stress error led by the ignorance of substrate thermal deformation was studied. Results showed that this error could be as large as several hundred MPa under general deposition conditions. Stress in the CrN thin films with different thicknesses ranging from 110 to 330 nm on stainless steel was studied by this method, in comparison with conventional results on silicon wafer. The thin films' morphology and structure were investigated and related to the film stress. A significant result of the comparison is that stress evolution in the thin films on steel obviously differs from that on silicon wafer, not only because the two substrates have different coefficients of thermal expansion, which provokes thermal stress, but also the considerable discrepancy in the thin films' grain coarsening rate and structure that induce different intrinsic stresses.
部门归属	[fan, di ; lei, hao ; guo, chao-qian ; gong, jun ; sun, chao] chinese acad sci, inst met res, shenyang 110016, peoples r china ; [fan, di] univ chinese acad sci, beijing 100049, peoples r china ; [qi, dong-li] shenyang ligong univ, sch sci, shenyang 110159, peoples r china
关键词	Chromium Nitride Films Compressive Stress Residual-stresses Intrinsic Stress Magnetron Evolution Coatings Microstructure Deposition Profiles
学科领域	Metallurgy & Metallurgical Engineering
收录类别	SCI
语种	英语
WOS记录号	WOS:000427710700012
引用统计	被引频次：6[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/79455
专题	中国科学院金属研究所
通讯作者	Lei, H; Sun, C (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
推荐引用方式 GB/T 7714	Fan, D,Lei, H,Guo, CQ,et al. Stress Study on CrN Thin Films with Different Thicknesses on Stainless Steel[J]. ACTA METALLURGICA SINICA-ENGLISH LETTERS,2018,31(3):329-336.
APA	Fan, D.,Lei, H.,Guo, CQ.,Qi, DL.,Gong, J.,...&Sun, C .(2018).Stress Study on CrN Thin Films with Different Thicknesses on Stainless Steel.ACTA METALLURGICA SINICA-ENGLISH LETTERS,31(3),329-336.
MLA	Fan, D,et al."Stress Study on CrN Thin Films with Different Thicknesses on Stainless Steel".ACTA METALLURGICA SINICA-ENGLISH LETTERS 31.3(2018):329-336.