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The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy
Ong, Chun Yee Aaron; Blackwood, Daniel John; Li, Yi
2019-01-15
Source PublicationSURFACE & COATINGS TECHNOLOGY
ISSN0257-8972
Volume357Pages:23-27
AbstractNanocrystalline and amorphous nickel-tungsten alloy with relatively high tungsten contents of up to 34 at.% were produced by electrodeposition. The Hall-Petch relationship and breakdown was studied in this alloy, with grain sizes ranging from 25 nm to fully amorphous. In this higher tungsten content alloy, evidence of solid-solution strengthening was found, which was previously absent in alloys with < 13 at.% tungsten. A Hall-Petch trend with a critical grain size of 5 nm was observed, in line with expectations.
KeywordNickel-tungsten Hall-Petch effect Electrodeposition Nanocrystalline metal Nickel alloys
Indexed BySCI
Language英语
WOS IDWOS:000455691100003
PublisherELSEVIER SCIENCE SA
Citation statistics
Cited Times:8[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/81451
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
Ong, Chun Yee Aaron,Blackwood, Daniel John,Li, Yi. The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy[J]. SURFACE & COATINGS TECHNOLOGY,2019,357:23-27.
APA Ong, Chun Yee Aaron,Blackwood, Daniel John,&Li, Yi.(2019).The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy.SURFACE & COATINGS TECHNOLOGY,357,23-27.
MLA Ong, Chun Yee Aaron,et al."The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy".SURFACE & COATINGS TECHNOLOGY 357(2019):23-27.
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