Molecular dynamics study of the structure changes in a high-angle Cu grain boundary by heating and quenching

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	Molecular dynamics study of the structure changes in a high-angle Cu grain boundary by heating and quenching
	Lin, Z; Wang, SQ; Ye, HQ
通讯作者	Lin, Z()
	2004-08-01
发表期刊	ACTA PHYSICA SINICA
ISSN	1000-3290
卷号	53 期号:8 页码:2497-2502
摘要	The structure changes of a Cu Sigma = 5 ( 310)/[001] symmetrical tilt grain boundary are investigated using the molecular dynamics method by heating and quenching. The simulated results showed that with increasing temperature, there are structure changes of the grain boundary. At a temperature significantly below the bulk melting point of copper, the grain boundary undergoes a structure change, and there exists the crystal-melt coexistence in the grain boundary zone. The grain boundary structures can be changed by quenching,which are compared to those at the same temperatures by heating.
关键词	molecular dynamics grain boundary melt solidification
收录类别	SCI
语种	英语
WOS研究方向	Physics
WOS类目	Physics, Multidisciplinary
WOS记录号	WOS:000223179200017
出版者	CHINESE PHYSICAL SOC
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/81692
通讯作者	Lin, Z
作者单位	Chinese Acad Sci, Met Res Inst, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Lin, Z,Wang, SQ,Ye, HQ. Molecular dynamics study of the structure changes in a high-angle Cu grain boundary by heating and quenching[J]. ACTA PHYSICA SINICA,2004,53(8):2497-2502.
APA	Lin, Z,Wang, SQ,&Ye, HQ.(2004).Molecular dynamics study of the structure changes in a high-angle Cu grain boundary by heating and quenching.ACTA PHYSICA SINICA,53(8),2497-2502.
MLA	Lin, Z,et al."Molecular dynamics study of the structure changes in a high-angle Cu grain boundary by heating and quenching".ACTA PHYSICA SINICA 53.8(2004):2497-2502.