Bi segregation at interface of the eutectic SnBi/Cu solder joint

IMR OpenIR

	Bi segregation at interface of the eutectic SnBi/Cu solder joint
	Liu, CZ ; Zhang, W ; Sui, ML ; Shang, JK
通讯作者	Liu, CZ(czliu@imr.ac.cn)
	2005-08-01
发表期刊	ACTA METALLURGICA SINICA
ISSN	0412-1961
卷号	41 期号:8 页码:847-852
摘要	The interfacial microstructure of eutectic SnBi/Cu interconnect was examined by SEM, TEM and XRD. It was found that after aging at 120 degrees C for 7 d, the intermetallic compound (IMC) at the interface evolved from Cu6Sn5 plus Cu3Sn and the thickness of IMC layer increased from 2 mu m to 10 mu m. TEM observation revealed a number of Bi particles with size of about 100 nm distributed along the Cu3Sn/Cu interface in the aged interconnect. Micro-force testing of interconnects indicated that upon aging, the fracture toughness KIC of the interconnect decreased greatly and fracture mode changed from ductile to brittle. While the crack path was along the interface between IMC and solder in the as-reflowed condition, it was shifted to the interface between Cu3Sn and Cu substrate after aging. By comparing with the same interface in the pure Sn/Cu interconnect aged at 220 degrees C for 5 d, it was conclused that the presence of Bi particles is responsible for the embrittlement of the interface. The Bi-induced embrittlement presents a serious concern over the suitability of Bi-containing Pb-free solders for microelectronic packaging.
关键词	eutectic SnBi/Cu solder joint segregation interfacial reaction Pb-free solder
收录类别	SCI
语种	英语
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000231652000013
出版者	SCIENCE PRESS
引用统计	被引频次：10[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/84524
专题	中国科学院金属研究所
通讯作者	Liu, CZ
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA 3.Shenyang Inst Aeronaut Engn, Dept Mat Engn, Shenyang 110034, Peoples R China
推荐引用方式 GB/T 7714	Liu, CZ,Zhang, W,Sui, ML,et al. Bi segregation at interface of the eutectic SnBi/Cu solder joint[J]. ACTA METALLURGICA SINICA,2005,41(8):847-852.
APA	Liu, CZ,Zhang, W,Sui, ML,&Shang, JK.(2005).Bi segregation at interface of the eutectic SnBi/Cu solder joint.ACTA METALLURGICA SINICA,41(8),847-852.
MLA	Liu, CZ,et al."Bi segregation at interface of the eutectic SnBi/Cu solder joint".ACTA METALLURGICA SINICA 41.8(2005):847-852.