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Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384
Authors:  Q. K. Zhang;  Z. F. Zhang
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Sn-ag/cu Solder Joints  Thermal Fatigue  Strain Localization  Grain  Rotation  Dynamic Recovery  Stress-relaxation Behavior  Eutectic Sn-3.5ag Solder  Lead-free Solders  Pb-free Solders  Sn-ag  Tensile Properties  Shear-strength  Fracture-behavior  Deformation  Creep  
In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints 期刊论文
Acta Materialia, 2011, 卷号: 59, 期号: 15, 页码: 6017-6028
Authors:  Q. K. Zhang;  Z. F. Zhang
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Snag/cu Solder Joints  Creep Fatigue  In Situ Observation  Strain  Localization  Grain Subdivision  Lead-free Solders  Pb-sn Solder  Tensile Properties  Shear-strength  Deformation-behavior  Sn-3.5ag Solder  Strain-rate  Ag  Microstructure  Alloys  
Fatigue fracture mechanisms of Cu/lead-free solders interfaces 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1367-1376
Authors:  Q. K. Zhang;  Q. S. Zhu;  H. F. Zou;  Z. F. Zhang
Adobe PDF(2369Kb)  |  Favorite  |  View/Download:53/0  |  Submit date:2012/04/13
Lead-free Solder  Fatigue Fracture  Interface  Strain Localization  Vertical Cracks  Lead-free Solders  Pb-free Solders  Deformation-behavior  Joints  Tensile  Cu  Embrittlement  Temperature  Sn-3.5ag  Alloy  
Enhanced stress relaxation of Sn-3.8Ag-0.7Cu solder by electrical current 期刊论文
Journal of Materials Research, Journal of Materials Research, 2010, 2010, 卷号: 25, 25, 期号: 6, 页码: 1172-1178, 1172-1178
Authors:  H. Y. Liu;  Q. S. Zhu;  L. Zhang;  Z. G. Wang;  J. K. Shang
Adobe PDF(758Kb)  |  Favorite  |  View/Download:24/0  |  Submit date:2012/04/13
Pb-free Solder  Pb-free Solder  Electromigration-induced Failure  Electromigration-induced Failure  Creep-behavior  Creep-behavior  Joints  Joints  Alloy  Alloy  Sn  Sn  Tin  Tin  Composite  Composite  Mechanism  Mechanism  
Crack propagation of single crystal beta-Sn during in situ TEM straining 期刊论文
Journal of Electron Microscopy, 2010, 卷号: 59, 页码: S61-S66
Authors:  P. J. Shang;  Z. Q. Liu;  D. X. Li;  J. K. Shang
Favorite  |  View/Download:35/0  |  Submit date:2012/04/13
In Situ Tem  Straining  Single Crystal Sn  Slip System  Self-diffusion  Crack Propagation  Free Solder Alloys  Lead-free Solders  Thermal Fatigue  Behavior  Creep  Tin  Pb  Joints  Ag  Deformation  
ACTA METALLURGICA SINICA, 2009, 卷号: 45, 期号: 8, 页码: 912-918
Authors:  Wang Xiaojing;  Zhu Qingsheng;  Wang Zhongguang;  Shang Jianku
Favorite  |  View/Download:25/0  |  Submit date:2021/02/02
Pb-free solder  particle coarsening  electric current  
Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate 期刊论文
Scripta Materialia, 2009, 卷号: 61, 期号: 3, 页码: 308-311
Authors:  H. F. Zou;  Q. K. Zhang;  Z. F. Zhang
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Bi Interfacial Segregation  Embrittlement  Pb-free Solder  Interfacial  Strength  Soldering  Copper Grain-boundaries  Fracture  Boron  Chemistry  Ni3al  
Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint 期刊论文
Journal of Alloys and Compounds, 2008, 卷号: 461, 期号: 1-2, 页码: 410-417
Authors:  H. F. Zou;  Q. S. Zhu;  Z. F. Zhang
Adobe PDF(1268Kb)  |  Favorite  |  View/Download:18/0  |  Submit date:2012/04/13
Ag Single Crystal Substrate  Sn-3.8ag-0.7cu Solder  Intermetallic  Compounds (Imcs)  Growth Kinetics  Tensile Strength  Fracture  Lead-free Solder  Interfacial Reaction  Cu-substrate  Microstructure  Metallization  Sn-3.5ag  Bump  Ni  Strength  Pb  
Degradation of solderability of electroless nickel by phosphide particles 期刊论文
Surface & Coatings Technology, Surface & Coatings Technology, 2007, 2007, 卷号: 202, 202, 期号: 2, 页码: 268-274, 268-274
Authors:  J. J. Guo;  A. P. Man;  J. K. Shang
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Solderability  Solderability  Electroless Nickel  Electroless Nickel  Wetting  Wetting  Pb-free Solder  Pb-free Solder  Snagcu Alloy  Snagcu Alloy  Lead-free Solders  Lead-free Solders  State Interfacial Reaction  State Interfacial Reaction  Ni-plated Kovar  Ni-plated Kovar  Ag-cu  Ag-cu  Solders  Solders  Intermetallic Compounds  Intermetallic Compounds  Mechanical-properties  Mechanical-properties  Bump  Bump  Metallization  Metallization  Microstructure  Microstructure  Copper  Copper  Wettability  Wettability  
Mechanical fatigue of Sn-rich Pb-free solder alloys 期刊论文
Journal of Materials Science-Materials in Electronics, 2007, 卷号: 18, 期号: 1-3, 页码: 211-227
Authors:  J. K. Shang;  Q. L. Zeng;  L. Zhang;  Q. S. Zhu
Favorite  |  View/Download:29/0  |  Submit date:2012/04/13
Low-cycle Fatigue  Lead-free Solders  Crack-growth-behavior  Thermal  Fatigue  63sn-37pb Solder  Eutectic Solder  Thermomechanical Fatigue  Ag-cu  Joints  Life