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Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
Favorite  |  View/Download：201/0  |  Submit date：2021/02/02
Sn-Cu  microstructures  IMC  mechanical properties  
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei;  Jiang, Nan;  Xu, Kai-kai
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Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei;  Jiang, Nan;  Xu, Kai-kai
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The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
Authors:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
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Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength  
Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain 期刊论文
ELSEVIER SCIENCE SA, 2017, 卷号: 701, 页码: 187-195
Authors:  Zhang, Q. K.;  Hu, F. Q.;  Song, Z. L.;  Zhang, Z. F.;  Zhang, QK (reprint author), Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Zhejiang, Peoples R China.
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Viscoplastic Creep  In-situ Ebsd  Polygonization  Grain Boundary Sliding  Strain Concentration  
Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder 期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 5, 页码: -
Authors:  Yang, Fan;  Zhang, Liang;  Liu, Zhi-quan;  Zhong, Su Juan;  Ma, Jia;  Bao, Li;  Zhang, L (reprint author), Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou 221116, Peoples R China.;  Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
Favorite  |  View/Download：78/0  |  Submit date：2017/08/17
Sn-58bi Solder  Lead-free Solder  Microstructure  
Anand constitutive model of lead-free solder joints in 3D IC device 期刊论文
Journal of Physics: Conference Series, 2016, 卷号: 738, 期号: 1
Authors:  Zhang,Liang;  Liu,Zhi-quan;  Ji,Yu-tong
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Properties and Microstructures of Sn-Bi-X Lead-Free Solders 期刊论文
ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2016, 页码: 15
Authors:  Yang, Fan;  Zhang, Liang;  Liu, Zhi-quan;  Zhong, Su-juan;  Ma, Jia;  Bao, Li
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Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355
Authors:  F. F. Tian;  Z. Q. Liu;  P. J. Shang;  J. D. Guo
Favorite  |  View/Download：88/0  |  Submit date：2014/04/18
Phase Identification  Interface  Imc  Eutectic Snin Solder  Single  Crystalline Cu  Gamma-angular Correlations  Lead-free Solders  Joint Reliability  Growth-kinetics  System  Equilibria  Mechanisms  Interfaces  Diffusion  Layer  
Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 3, 页码: 1228-1236
Authors:  M. N. Wang;  J. Q. Wang;  W. Ke
Favorite  |  View/Download：73/0  |  Submit date：2014/04/18
Lead-free Solders  3.5-percent Nacl Solution  Electrochemical Corrosion  Ga Solder  Reliability  Surface  Alloys  Joints  Tin  Sn