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Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
Favorite  |  View/Download:4/0  |  Submit date:2020/01/06
Sn-Cu  microstructures  IMC  mechanical properties  
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei;  Jiang, Nan;  Xu, Kai-kai
Favorite  |  View/Download:5/0  |  Submit date:2020/01/06
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
Authors:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
Favorite  |  View/Download:22/0  |  Submit date:2018/06/05
Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength  
Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain 期刊论文
ELSEVIER SCIENCE SA, 2017, 卷号: 701, 页码: 187-195
Authors:  Zhang, Q. K.;  Hu, F. Q.;  Song, Z. L.;  Zhang, Z. F.;  Zhang, QK (reprint author), Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Zhejiang, Peoples R China.
Favorite  |  View/Download:36/0  |  Submit date:2018/01/10
Viscoplastic Creep  In-situ Ebsd  Polygonization  Grain Boundary Sliding  Strain Concentration  
Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder 期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 5, 页码: -
Authors:  Yang, Fan;  Zhang, Liang;  Liu, Zhi-quan;  Zhong, Su Juan;  Ma, Jia;  Bao, Li;  Zhang, L (reprint author), Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou 221116, Peoples R China.;  Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
Favorite  |  View/Download:26/0  |  Submit date:2017/08/17
Sn-58bi Solder  Lead-free Solder  Microstructure  
Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933
Authors:  H. Zhang;  Q. S. Zhu;  Z. Q. Liu;  L. Zhang;  H. Y. Guo;  C. M. Lai
Favorite  |  View/Download:119/0  |  Submit date:2015/01/14
Fe-ni Alloy  Under Bump Metallization (Ubm)  Intermetallic Compound  (Imc)  Reliability  High Temperature Storage  Temperature Cycling  Lead-free Solders  Intermetallic Compounds  Growth-kinetics  Cu  Metallization  Ag  Strength  Ball  Ubm  
Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 12, 页码: 5269-5276
Authors:  M. N. Wang;  J. Q. Wang;  W. Ke
Favorite  |  View/Download:152/0  |  Submit date:2015/01/14
3.5-percent Nacl Solution  Electrochemical Corrosion  Polarization  Characteristics  Alloys  Surface  Joints  
Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 5, 页码: 2297-2304
Authors:  X. J. Wang;  Q. S. Zhu;  B. Liu;  N. Liu;  F. J. Wang
Favorite  |  View/Download:123/0  |  Submit date:2014/07/03
Lead-free Solder  Intermetallic Compound Growth  Corrosion Behavior  Mechanical-properties  Cu Substrate  Alloy  Microstructure  Reduction  Aluminum  Vacuum  
Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355
Authors:  F. F. Tian;  Z. Q. Liu;  P. J. Shang;  J. D. Guo
Favorite  |  View/Download:136/0  |  Submit date:2014/04/18
Phase Identification  Interface  Imc  Eutectic Snin Solder  Single  Crystalline Cu  Gamma-angular Correlations  Lead-free Solders  Joint Reliability  Growth-kinetics  System  Equilibria  Mechanisms  Interfaces  Diffusion  Layer  
Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition 期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 3, 页码: 1228-1236
Authors:  M. N. Wang;  J. Q. Wang;  W. Ke
Favorite  |  View/Download:205/0  |  Submit date:2014/04/18
Lead-free Solders  3.5-percent Nacl Solution  Electrochemical Corrosion  Ga Solder  Reliability  Surface  Alloys  Joints  Tin  Sn