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Structure and properties of Sn-Cu lead-free solders in electronics packaging
期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
Authors:
Zhao, Meng
;
Zhang, Liang
;
Liu, Zhi-Quan
;
Xiong, Ming-Yue
;
Sun, Lei
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View/Download:201/0
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Submit date:2021/02/02
Sn-Cu
microstructures
IMC
mechanical properties
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
Authors:
Zhao, Meng
;
Zhang, Liang
;
Liu, Zhi-quan
;
Xiong, Ming-yue
;
Sun, Lei
;
Jiang, Nan
;
Xu, Kai-kai
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View/Download:76/0
  |  
Submit date:2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
Authors:
Zhao, Meng
;
Zhang, Liang
;
Liu, Zhi-quan
;
Xiong, Ming-yue
;
Sun, Lei
;
Jiang, Nan
;
Xu, Kai-kai
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View/Download:58/0
  |  
Submit date:2021/02/02
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
Authors:
Gao, LY
;
Li, CF
;
Wan, P
;
Zhang, H
;
Liu, ZQ
;
Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
;
Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
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View/Download:95/0
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Submit date:2018/06/05
Lead-free Solders
Interfacial Reactions
Sn-ag
Intermetallic Compounds
Rich Solders
Joints
Growth
Reliability
Substrate
Strength
Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain
期刊论文
ELSEVIER SCIENCE SA, 2017, 卷号: 701, 页码: 187-195
Authors:
Zhang, Q. K.
;
Hu, F. Q.
;
Song, Z. L.
;
Zhang, Z. F.
;
Zhang, QK (reprint author), Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Zhejiang, Peoples R China.
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View/Download:79/0
  |  
Submit date:2018/01/10
Viscoplastic Creep
In-situ Ebsd
Polygonization
Grain Boundary Sliding
Strain Concentration
Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder
期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 5, 页码: -
Authors:
Yang, Fan
;
Zhang, Liang
;
Liu, Zhi-quan
;
Zhong, Su Juan
;
Ma, Jia
;
Bao, Li
;
Zhang, L (reprint author), Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou 221116, Peoples R China.
;
Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
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View/Download:78/0
  |  
Submit date:2017/08/17
Sn-58bi Solder
Lead-free Solder
Microstructure
Anand constitutive model of lead-free solder joints in 3D IC device
期刊论文
Journal of Physics: Conference Series, 2016, 卷号: 738, 期号: 1
Authors:
Zhang,Liang
;
Liu,Zhi-quan
;
Ji,Yu-tong
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  |  
View/Download:103/0
  |  
Submit date:2021/02/02
Properties and Microstructures of Sn-Bi-X Lead-Free Solders
期刊论文
ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2016, 页码: 15
Authors:
Yang, Fan
;
Zhang, Liang
;
Liu, Zhi-quan
;
Zhong, Su-juan
;
Ma, Jia
;
Bao, Li
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View/Download:52/0
  |  
Submit date:2021/02/02
Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate
期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355
Authors:
F. F. Tian
;
Z. Q. Liu
;
P. J. Shang
;
J. D. Guo
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View/Download:88/0
  |  
Submit date:2014/04/18
Phase Identification
Interface
Imc
Eutectic Snin Solder
Single
Crystalline Cu
Gamma-angular Correlations
Lead-free Solders
Joint Reliability
Growth-kinetics
System
Equilibria
Mechanisms
Interfaces
Diffusion
Layer
Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition
期刊论文
Journal of Materials Science-Materials in Electronics, 2014, 卷号: 25, 期号: 3, 页码: 1228-1236
Authors:
M. N. Wang
;
J. Q. Wang
;
W. Ke
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View/Download:73/0
  |  
Submit date:2014/04/18
Lead-free Solders
3.5-percent Nacl Solution
Electrochemical Corrosion
Ga Solder
Reliability
Surface
Alloys
Joints
Tin
Sn