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Reliability issues of lead-free solder joints in electronic devices 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
Authors:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-Quan;  Sun, Lei;  Long, Wei-Min;  He, Peng;  Xiong, Ming-Yue;  Zhao, Meng
Favorite  |  View/Download:8/0  |  Submit date:2020/01/06
Lead-free solder  reliability  IMC  crack  failure  
Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
Favorite  |  View/Download:4/0  |  Submit date:2020/01/06
Sn-Cu  microstructures  IMC  mechanical properties  
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
Authors:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-quan;  Sun, Lei;  Xiong, Ming-yue;  Zhao, Meng;  Xu, Kai-kai
Favorite  |  View/Download:3/0  |  Submit date:2020/01/06
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei;  Jiang, Nan;  Xu, Kai-kai
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Sn-Cu系无铅钎料的研究进展及发展趋势 期刊论文
材料导报, 2019, 卷号: 33, 期号: 15, 页码: 2467-2478
Authors:  赵猛;  张亮;  熊明月
Favorite  |  View/Download:3/0  |  Submit date:2020/01/06
Sn-Cu  微观组织  评价指标  钎剂  
FCBGA器件SnAgCu焊点的热冲击可靠性分析 期刊论文
焊接学报, 2019, 卷号: 40, 期号: 09, 页码: 39-42+162
Authors:  姜楠;  张亮;  刘志权;  熊明月;  龙伟民
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有限元法  热冲击  焊点  可靠性  疲劳寿命  
基于田口法的CSP器件结构优化设计 期刊论文
焊接学报, 2018, 卷号: 39, 期号: 05, 页码: 51-54+131
Authors:  熊明月;  张亮;  刘志权;  杨帆;  钟素娟;  马佳;  鲍丽
Favorite  |  View/Download:24/0  |  Submit date:2018/12/25
芯片尺寸封装  田口法  热循环  焊点  
微量元素对SnAgCu/Cu界面金属间化合物的影响研究综述 期刊论文
电子元件与材料, 2018, 期号: 11, 页码: 12-19+25
Authors:  熊明月;  张亮;  刘志权;  龙伟民;  钟素娟
Favorite  |  View/Download:12/0  |  Submit date:2018/12/25
焊点  界面反应  综述  金属间化合物  断裂  可靠性  
掺V和Ag的TiAl合金中缺陷和电子密度的正电子湮没研究(英文) 期刊论文
稀有金属材料与工程, 2006, 期号: 3, 页码: 348-351
Authors:  邓文;  祝莹莹;  周银娥;  黄宇阳;  曹名洲;  熊良钺
Favorite  |  View/Download:166/0  |  Submit date:2012/04/12
Tial合金  电子密度  缺陷  正电子湮没