Reliability issues of lead-free solder joints in electronic devices

doi:10.1080/14686996.2019.1640072

IMR OpenIR

	Reliability issues of lead-free solder joints in electronic devices
	Jiang, Nan 1; Zhang, Liang 1,2; Liu, Zhi-Quan 3; Sun, Lei 4; Long, Wei-Min 5; He, Peng 2; Xiong, Ming-Yue 1; Zhao, Meng 1
通讯作者	Zhang, Liang(zhangliang@jsnu.edu.cn)
	2019-12-31
发表期刊	SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
ISSN	1468-6996
卷号	20 期号:1 页码:876-901
摘要	Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure in electronic devices originates during the packaging process, mostly due to the failure of solder joints. With the improvement of environmental protection awareness, lead-free solder joints have become a hot issue in recent years. This paper reviews the research progress on the reliability of lead-free solder joints and discusses the influence of temperature, vibration, tin whisker and electromigration on the reliability of solder joints. In addition, the measures to improve the reliability of solder joints are analyzed according to the problems of solder joints themselves, which provides a further theoretical basis for the study of the reliability of solder joints of electronic products in service.
关键词	Lead-free solder reliability IMC crack failure
资助者	National Key R&D Program of China ; Key project of State Key Laboratory of Advanced Welding and Joining ; Qing Lan Project ; Six talent peaks project in Jiangsu Province ; Natural Science Foundation of China
DOI	10.1080/14686996.2019.1640072
收录类别	SCI
语种	英语
资助项目	National Key R&D Program of China[2017YFB0305700] ; Key project of State Key Laboratory of Advanced Welding and Joining[AWJ-19Z04] ; Qing Lan Project ; Six talent peaks project in Jiangsu Province[XCL-022] ; Natural Science Foundation of China[51475220] ; [2015DFA50470]
WOS研究方向	Materials Science
WOS类目	Materials Science, Multidisciplinary
WOS记录号	WOS:000483617100001
出版者	TAYLOR & FRANCIS LTD
引用统计	被引频次：122[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/135406
专题	中国科学院金属研究所
通讯作者	Zhang, Liang
作者单位	1.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China 2.Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin, Heilongjiang, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang, Liaoning, Peoples R China 4.Nanjing Univ Aeronaut & Astronaut, Natl Key Lab Sci & Technol Helicopter Transmiss, Nanjing, Jiangsu, Peoples R China 5.Zhengzhou Res Inst Mech Engn, State Key Lab Adv Brazing Filler Met & Technol, Zhengzhou, Henan, Peoples R China
推荐引用方式 GB/T 7714	Jiang, Nan,Zhang, Liang,Liu, Zhi-Quan,et al. Reliability issues of lead-free solder joints in electronic devices[J]. SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS,2019,20(1):876-901.
APA	Jiang, Nan.,Zhang, Liang.,Liu, Zhi-Quan.,Sun, Lei.,Long, Wei-Min.,...&Zhao, Meng.(2019).Reliability issues of lead-free solder joints in electronic devices.SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS,20(1),876-901.
MLA	Jiang, Nan,et al."Reliability issues of lead-free solder joints in electronic devices".SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS 20.1(2019):876-901.