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Reliability issues of lead-free solder joints in electronic devices 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
Authors:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-Quan;  Sun, Lei;  Long, Wei-Min;  He, Peng;  Xiong, Ming-Yue;  Zhao, Meng
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Lead-free solder  reliability  IMC  crack  failure  
Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
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Sn-Cu  microstructures  IMC  mechanical properties  
Effects of Temperature on Fretting Corrosion Between Alloy 690TT and 405 Stainless Steel in Pure Water 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 12, 页码: 1437-1448
Authors:  Liu, Xing-Chen;  Ming, Hong-Liang;  Zhang, Zhi-Ming;  Wang, Jian-Qiu;  Tang, Li-Chen;  Qian, Hao;  Xie, Yong-Cheng;  Han, En-Hou
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Alloy 690TT  405 SS  Fretting corrosion  Temperature  
Nonequilibrium quantum phase transition in a spinor quantum gas in a lattice coupled to a membrane 期刊论文
PHYSICAL REVIEW A, 2019, 卷号: 100, 期号: 5
Authors:  Xu, Xingran;  Zhang, Zhidong;  Liang, Zhaoxin
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Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
Authors:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan
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Co target assembly  Solder  Residual stress  Simulation  Taguchi method  Optimal design  
FeCr_(15)Ni_(15)单晶600℃下热生长氧化膜的TEM观察 期刊论文
中国腐蚀与防护学报, 2019, 卷号: 39, 期号: 05, 页码: 417-422
Authors:  魏欣欣;  张波;  马秀良
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氧化膜  TEM  FeCr15Ni15单晶  微观结构  
Deformation characteristics in hydro-mechanical forming process of thin-walled hollow component with large deformation: experimentation and finite element modeling 期刊论文
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2019, 卷号: 104, 期号: 2020-09-12, 页码: 4705-4714
Authors:  Xia, Liang-Liang;  Xu, Yong;  Abd El-Aty, Ali;  Zhang, Shi-Hong;  Nielsen, Karl Brian;  Li, Jing-Ming
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Tube hydro-mechanical forming  Thin-walled hollow component  Large deformation  Hydroforming  FE modeling  
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
Authors:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-quan;  Sun, Lei;  Xiong, Ming-yue;  Zhao, Meng;  Xu, Kai-kai
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Atomic-Scale Observation of Bimetallic Au-CuOx Nanoparticles and Their Interfaces for Activation of CO Molecules 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2019, 卷号: 11, 期号: 38, 页码: 35468-35478
Authors:  Luo, Jingjie;  Liu, Yuefeng;  Zhang, Liyun;  Ren, Yujing;  Miao, Shu;  Zhang, Bingsen;  Su, Dang Sheng;  Liang, Changhai
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Au catalysis  Au-Cu bimetallic particles  defect-enriched surface  step sites  CO activation  
A model revealing grain boundary arrangement-dominated fatigue cracking behavior in nanoscale metallic multilayers 期刊论文
MRS COMMUNICATIONS, 2019, 卷号: 9, 期号: 3, 页码: 936-940
Authors:  Liang, Fei;  Wang, Dong;  Li, Xi;  Luo, Xue-Mei;  Schaaf, Peter;  Zhang, Guang-Ping
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