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Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
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Sn-Cu  microstructures  IMC  mechanical properties  
Hot compression deformation behavior of Mg-5Zn-3.5Sn-1Mn-0.5Ca-0.5Cu alloy 期刊论文
MATERIALS CHARACTERIZATION, 2019, 卷号: 157
Authors:  Wang, Cong;  Liu, Yunteng;  Lin, Tao;  Luo, Tianjiao;  Zhao, Yuhong;  Hou, Hua;  Yang, Yuansheng
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Mg-5Zn-3.5Sn-1Mn-0.5Ca-0.5Cu alloy  Hot compression  Processing map  Coarse particles  Microstructure evolution  
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
Authors:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-quan;  Sun, Lei;  Xiong, Ming-yue;  Zhao, Meng;  Xu, Kai-kai
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Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
Authors:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
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62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei;  Jiang, Nan;  Xu, Kai-kai
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Sn-Cu系无铅钎料的研究进展及发展趋势 期刊论文
材料导报, 2019, 卷号: 33, 期号: 15, 页码: 2467-2478
Authors:  赵猛;  张亮;  熊明月
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Sn-Cu  微观组织  评价指标  钎剂  
C194铜合金表面热浸镀SnAgCu镀层的组织与性能 期刊论文
材料热处理学报, 2019, 卷号: 40, 期号: 04, 页码: 114-120
Authors:  朱宏喜;  田保红;  张毅;  任凤章;  史浩鹏;  王胜刚
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热浸镀SnAgCu镀层  Cu_6Sn_5  润湿性  耐蚀性能  
Liquid-liquid hierarchical separation and metal recycling of waste printed circuit boards 期刊论文
JOURNAL OF HAZARDOUS MATERIALS, 2019, 卷号: 364, 页码: 388-395
Authors:  Chen, Bin;  He, Jie;  Xi, Yaoyao;  Zeng, Xiangfeng;  Kaban, Ivan;  Zhao, Jiuzhou;  Hao, Hongri
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Waste printed circuit boards  Metal recycling  Liquid-liquid phase separation  Immiscible alloys  Super-gravity technology  Pyrolysis  
FCBGA器件SnAgCu焊点的热冲击可靠性分析 期刊论文
焊接学报, 2019, 卷号: 40, 期号: 09, 页码: 39-42+162
Authors:  姜楠;  张亮;  刘志权;  熊明月;  龙伟民
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有限元法  热冲击  焊点  可靠性  疲劳寿命  
Microstructure and mechanical properties of Mg-5Zn-3.5Sn-1Mn-0.5Ca-0.5Cu alloy 期刊论文
MATERIALS CHARACTERIZATION, 2019, 卷号: 147, 页码: 406-413
Authors:  Wang, Cong;  Luo, Tianjiao;  Liu, Yunteng;  Lin, Tao;  Yang, Yuansheng
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Mg-Zn-Sn-Mn-Ca-Cu  Double aging  Precipitate  Mechanical properties