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Structure-composition-property correlations of symmetrical tilt grain boundaries in copper-based binary alloys 期刊论文
JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 2021, 卷号: 154, 页码: 9
Authors:  Xue, Hongtao;  Lei, Chao;  Tang, Fuling;  Li, Xiuyan;  Luo, Yaqiao;  Ren, Junqiang;  Lu, Xuefeng
Favorite  |  View/Download：21/0  |  Submit date：2021/10/15
Alloys  Ab initio calculations  Electronic structure  Thermodynamic properties  Mechanical properties  
Residual stress and precipitation of Mg-5Zn-3.5Sn-1Mn-0.5Ea-0.5Cu alloy with different quenching rates 期刊论文
JOURNAL OF MAGNESIUM AND ALLOYS, 2021, 卷号: 9, 期号: 2, 页码: 604-612
Authors:  Wang, Cong;  Luo, Tianjiao;  Liu, Yunteng;  Huang, Qiuyan;  Yang, Yuansheng
Favorite  |  View/Download：8/0  |  Submit date：2021/10/15
Mg-5Zn-3.5Sn-1Mn-0.5Ca-0.5Cu alloy  Solution treatment  Quenching rate  Residual stress  Precipitation  Age-hardening  
Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262
Authors:  Liu, C. Z.;  Wang, J. J.;  Zhu, M. W.;  Liu, X. M.;  Lu, T. N.;  Yang, J. R.
Favorite  |  View/Download：20/0  |  Submit date：2021/02/03
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
Authors:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
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Electrochemical Behavior and Electrodeposition of Sn Coating from Choline Chloride-Urea Deep Eutectic Solvents 期刊论文
COATINGS, 2020, 卷号: 10, 期号: 12
Authors:  Cao, Xiaozhou;  Xu, Lulu;  Wang, Chao;  Li, Siyi;  Wu, Dong;  Shi, Yuanyuan;  Liu, Fengguo;  Xue, Xiangxin
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Predicting the variation of stacking fault energy for binary Cu alloys by first-principles calculations 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 53, 页码: 61-65
Authors:  Cai, T.;  Li, K. Q.;  Zhang, Z. J.;  Zhang, P.;  Liu, R.;  Yang, J. B.;  Zhang, Z. F.
Favorite  |  View/Download：23/0  |  Submit date：2021/02/02
Cu-alloy  Deformation behavior  First-principles calculation  Stacking fault energy  
Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphere 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 51, 页码: 40-53
Authors:  Wang, Mingna;  Qiao, Chuang;  Jiang, Xiaolin;  Hao, Long;  Liu, Xiahe
Favorite  |  View/Download：22/0  |  Submit date：2021/02/02
SAC305 solder  Marine atmosphere  Galvanic corrosion  In-situ EIS  Comb-like electrode  
Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphere 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 51, 页码: 40-53
Authors:  Wang, Mingna;  Qiao, Chuang;  Jiang, Xiaolin;  Hao, Long;  Liu, Xiahe
Favorite  |  View/Download：15/0  |  Submit date：2021/02/02
SAC305 solder  Marine atmosphere  Galvanic corrosion  In-situ EIS  Comb-like electrode  
The open-pin failure of power device under the combined effect of thermo-migration and electro-migration 期刊论文
Chinese Science Bulletin, 2020, 卷号: 65, 期号: 20, 页码: 2169-2177
Authors:  Gao Liyin;  Li Caifu;  Cao Lihua;  Liu Zhiquan
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Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2020, 卷号: 33, 期号: 10, 页码: 9
Authors:  Wang, Changchang;  Chen, Yinbo;  Liu, Zhi-Quan
Favorite  |  View/Download：17/0  |  Submit date：2021/02/02
Cu-Sn IMC  Growth behavior  External stress effect  Isothermal aging