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Study on stress relaxation behavior and mechanism of typical high strength and elasticity copper alloy 期刊论文
MATERIALS TODAY COMMUNICATIONS, 2025, 卷号: 44, 页码: 11
作者:  Zhang, Mengxiao;  Song, Hongwu;  Guo, Wei;  Cheng, Ming;  Xu, Yong;  Jia, Yan;  Zhang, Yanyan;  Lin, Haoran;  Zhang, Shihong
收藏  |  浏览/下载：5/0  |  提交时间：2025/04/27
Cu-3Ti  Cu-15Ni-8Sn  Stress relaxation  Microstructure  Precipitate phase  
Effect of Zinc Element on Mechanical and Welding Properties of Cu-1.8Ni-0.45Si Alloy 期刊论文
ADVANCED ENGINEERING MATERIALS, 2025, 页码: 12
作者:  Lu, Lin;  Ding, Zeming;  Zhang, Mengxiao;  Song, Hongwu;  Xu, Yong;  Zhang, Shihong
收藏  |  浏览/下载：6/0  |  提交时间：2025/04/27
Cu-Ni-Si alloys  mechanical properties  weldability  zinc element  
Zinc Affinity and Hydrogen Evolution Trade-Off for Homogenous Zn Deposition in Reversible Zn Ion Batteries 期刊论文
SMALL, 2024, 卷号: 20, 期号: 50, 页码: 9
作者:  Yi, Zhehan;  Jia, Jingjing;  Yang, Jin-Lin;  Yu, Jin;  Tan, Shandong;  Li, Jia;  Liu, Xiaoqing;  Sang, Zhiyuan;  Yin, Lichang;  Liu, Huan;  Liang, Ji;  Hou, Feng
收藏  |  浏览/下载：3/0  |  提交时间：2025/04/27
Cu-Sn nanowire  dendrite  hydrogen evolution reaction  zinc anode  zinc ion batteries  
Improving the stability of microstructure and mechanical property in Cu-9Ni-6Sn-0.2Nb alloy by annealing treatment 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2024, 卷号: 916, 页码: 11
作者:  Xu, Siyang;  Wei, Jiaqi;  Han, Yahui;  Cao, Dongdong;  Jiang, Yifu;  Zhang, Junjia;  Wang, Xin;  Yan, Ziwen;  Sun, Shenghui;  Zang, Ximin;  Liu, Tongyu;  Ding, Hua
收藏  |  浏览/下载：5/0  |  提交时间：2025/04/27
Cu-9Ni-6Sn alloy  Discontinuous precipitation  Aging stability  Softening resistance  
Improving the stability of microstructure and mechanical property in Cu-9Ni-6Sn-0.2Nb alloy by annealing treatment 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2024, 卷号: 916, 页码: 11
作者:  Xu, Siyang;  Wei, Jiaqi;  Han, Yahui;  Cao, Dongdong;  Jiang, Yifu;  Zhang, Junjia;  Wang, Xin;  Yan, Ziwen;  Sun, Shenghui;  Zang, Ximin;  Liu, Tongyu;  Ding, Hua
收藏  |  浏览/下载：6/0  |  提交时间：2025/04/27
Cu-9Ni-6Sn alloy  Discontinuous precipitation  Aging stability  Softening resistance  
Improving the stability of microstructure and mechanical property in Cu-9Ni-6Sn-0.2Nb alloy by annealing treatment 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2024, 卷号: 916, 页码: 11
作者:  Xu, Siyang;  Wei, Jiaqi;  Han, Yahui;  Cao, Dongdong;  Jiang, Yifu;  Zhang, Junjia;  Wang, Xin;  Yan, Ziwen;  Sun, Shenghui;  Zang, Ximin;  Liu, Tongyu;  Ding, Hua
收藏  |  浏览/下载：4/0  |  提交时间：2025/04/27
Cu-9Ni-6Sn alloy  Discontinuous precipitation  Aging stability  Softening resistance  
First-principles calculations to investigate the structural stability, electronic and mechanical properties of CuGa 2 and Cu 9 Ga 4 期刊论文
MATERIALS TODAY COMMUNICATIONS, 2024, 卷号: 39, 页码: 9
作者:  Guo, Shihao;  Huang, Yaoxuan;  Wang, Li;  Gao, Zhaoqing;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：5/0  |  提交时间：2025/04/27
Intermetallic compounds  Elastic modulus  First-principles calculations  Low-temperature brazing  Micro-interconnection  
First-principles calculations to investigate the structural stability, electronic and mechanical properties of CuGa 2 and Cu 9 Ga 4 期刊论文
MATERIALS TODAY COMMUNICATIONS, 2024, 卷号: 39, 页码: 9
作者:  Guo, Shihao;  Huang, Yaoxuan;  Wang, Li;  Gao, Zhaoqing;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：7/0  |  提交时间：2025/04/27
Intermetallic compounds  Elastic modulus  First-principles calculations  Low-temperature brazing  Micro-interconnection  
Modificated microstructure and enhanced mechanical properties of Cu-Sn-P alloy with rare earth La addition 期刊论文
MATERIALS TODAY COMMUNICATIONS, 2024, 卷号: 39, 页码: 10
作者:  Wang, Songwei;  Yu, Kangkang;  Chen, Shuaifeng;  Deng, Siying;  Song, Hongwu;  Zhang, Shihong
收藏  |  浏览/下载：6/0  |  提交时间：2025/04/27
Cu-Sn-P alloy  La microalloying  Microstrcuture features  Mechanical properties  Strengthening mechanism  
Thermal stability and diffusion barrier performance of amorphous Ni-P layer at Sn/Ni-P/Cu interface 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2024, 卷号: 35, 期号: 13, 页码: 15
作者:  Yao, Jinye;  Shang, Min;  Chen, Xiangxu;  Xing, Jing;  Guo, Tianhao;  Wang, Yunpeng;  Ma, Haitao;  Gao, Zhaoqing
收藏  |  浏览/下载：7/0  |  提交时间：2025/04/27