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Molecular dynamic simulation of atomic clusters evolution in Cu-50%Ni alloy during rapid solidification
Liu, J; Zhao, JZ; Hu, ZQ
通讯作者Zhao, JZ()
2005-02-01
发表期刊ACTA METALLURGICA SINICA
ISSN0412-1961
卷号41期号:2页码:219-224
摘要The molecular dynamic simulations have been performed to study the atomic clusters evolution during various cooling processes of Cu-50%Ni alloy (atomic fraction). The basic structure unit of Cu-50%Ni glass formed at the cooling rate Of 1x 10(14) K/s and the arrangement of Cu and Ni atoms in these structures are investigated. The results indicate that the glass formed at higher cooling rate has higher energy and higher glass transition temperature (T-g). The short-range interaction between atoms becomes stronger and stronger in the cooling process. 1551 bonded pair plays an important role in the glass system and is sensitive to cooling rates. Not only icosahedra but also various defective polyhedra are found in the glass. In these defective polyhedra, those composed with more 1551 bonded pairs have a larger number. There are few Frank-Kasper and Bernal polyhedra in the alloy. Generally Cu atoms tend to locate at the vertexes while Ni atoms prefer to occupy the interspaces at the center of the polyhedra. The total number of the polyhedra decreases with the decrease of the cooling rate.
关键词Cu-Ni alloy rapid solidification atomic cluster molecular dynamic simulation
收录类别SCI
语种英语
WOS研究方向Metallurgy & Metallurgical Engineering
WOS类目Metallurgy & Metallurgical Engineering
WOS记录号WOS:000227656500021
出版者SCIENCE CHINA PRESS
引用统计
被引频次:3[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/85011
专题中国科学院金属研究所
通讯作者Zhao, JZ
作者单位Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China
推荐引用方式
GB/T 7714
Liu, J,Zhao, JZ,Hu, ZQ. Molecular dynamic simulation of atomic clusters evolution in Cu-50%Ni alloy during rapid solidification[J]. ACTA METALLURGICA SINICA,2005,41(2):219-224.
APA Liu, J,Zhao, JZ,&Hu, ZQ.(2005).Molecular dynamic simulation of atomic clusters evolution in Cu-50%Ni alloy during rapid solidification.ACTA METALLURGICA SINICA,41(2),219-224.
MLA Liu, J,et al."Molecular dynamic simulation of atomic clusters evolution in Cu-50%Ni alloy during rapid solidification".ACTA METALLURGICA SINICA 41.2(2005):219-224.
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