Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07.

doi:10.1016/j.msea.2006.07.100

IMR OpenIR

	Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07.
	Zhu, Q. S.; Zhang, Z. F.; Shang, J. K.; Wang, Z. G.
通讯作者	Zhang, Z. F.(zhfzhang@imr.ac.cn)
	2006-11-05
发表期刊	MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN	0921-5093
卷号	435 页码:588-594
摘要	Sn-Ag-Cu solder/copper single crystal joints were prepared to reveal the interfacial fatigue damage mechanisms. Scallop-type CU6Sn5 and planar-type CU6Sn5/CU3Sn intermetallic compounds (IMCs) interfaces were formed between SnAgCu solder and copper single crystal after re-flowing at 240 degrees C and subsequent aging at 170 degrees C, respectively. Under cyclic loading, persistent slip bands (PSBs) were activated in copper single crystal and continuously impinged the interfaces of the SnAgCu solder/copper single crystal joint. Two types of fatigue cracking modes, i.e. interfacial cracking between solder and IMC and fracture within IMC, were observed. Based on the experimental observations above, the corresponding interfacial fatigue cracking mechanisms were discussed. (c) 2006 Elsevier B.V. All rights reserved.
关键词	Sn-Ag-Cu solder copper single crystal intermetallic compounds (IMCs) interface cyclic deformation persistent slip bands (PSBs) fatigue cracking
DOI	10.1016/j.msea.2006.07.100
收录类别	SCI
语种	英语
WOS研究方向	Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000241683200078
出版者	ELSEVIER SCIENCE SA
引用统计	被引频次：32[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/85778
专题	中国科学院金属研究所
通讯作者	Zhang, Z. F.
作者单位	1.Chinese Acad Sci, Met Res Inst, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA
推荐引用方式 GB/T 7714	Zhu, Q. S.,Zhang, Z. F.,Shang, J. K.,et al. Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07.[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2006,435:588-594.
APA	Zhu, Q. S.,Zhang, Z. F.,Shang, J. K.,&Wang, Z. G..(2006).Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07..MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,435,588-594.
MLA	Zhu, Q. S.,et al."Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07.".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 435(2006):588-594.