Microstructure and fracture of Pb-free solder interconnects in CBGA packages under thermal cycling

IMR OpenIR

	Microstructure and fracture of Pb-free solder interconnects in CBGA packages under thermal cycling
	Wang, W ; Wang, ZG ; Xian, AP ; Shang, JK
通讯作者	Wang, ZG()
	2006-06-01
发表期刊	ACTA METALLURGICA SINICA
ISSN	0412-1961
卷号	42 期号:6 页码:647-652
摘要	Microstructure and thermal fatigue behavior of Pb-free solder interconnects in ceramic ball grid array (CBGA) packages were examined by cross-sectional microscopy, thermal cycling experiments and finite element modeling. In the as-reflowed condition, Cu6Sn5 and Ag3Sn formed at the solder interfaces with Cu and Ag metallizations respectively. Following thermal cycling, the Cu6Sn5 layer grew thicker and Cu3Sn was found at the interface with Cu metallization. On the ceramic side, visible thickening of the Ag3Sn layer was also observed. The morphology of Ag3Sn in the solder near the interface changed from strip-like to spherical shape. As a result of repeatedly thermal cycling, the fatigue crack appeared first at the corner of the solder ball with the chip, where the maximum shear stress was found by the finite element analysis. The cracks preferred to propagate along the Cu6Sn5/solder interface on the side of the print circuit board and in the solder joint near the interfacial Ag3Sn layer on the ceramic side.
关键词	Pb-free solder interconnect ceramic ball grid array (CBGA) finite element method thermal cycling
收录类别	SCI
语种	英语
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000238725300015
出版者	SCIENCE CHINA PRESS
引用统计	被引频次：6[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/87647
专题	中国科学院金属研究所
通讯作者	Wang, ZG
作者单位	1.Chinese Acad Sci, Met Res Inst, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Univ Illinois, Dept Mat & Engn, Urbana, IL 61801 USA
推荐引用方式 GB/T 7714	Wang, W,Wang, ZG,Xian, AP,et al. Microstructure and fracture of Pb-free solder interconnects in CBGA packages under thermal cycling[J]. ACTA METALLURGICA SINICA,2006,42(6):647-652.
APA	Wang, W,Wang, ZG,Xian, AP,&Shang, JK.(2006).Microstructure and fracture of Pb-free solder interconnects in CBGA packages under thermal cycling.ACTA METALLURGICA SINICA,42(6),647-652.
MLA	Wang, W,et al."Microstructure and fracture of Pb-free solder interconnects in CBGA packages under thermal cycling".ACTA METALLURGICA SINICA 42.6(2006):647-652.