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Achieving superior mechanical and corrosion properties in medium-thickness Ti-6Al-4 V alloy joints by back heating assisted friction stir welding below β-phase transformation temperature 期刊论文
MATERIALS CHARACTERIZATION, 2024, 卷号: 217, 页码: 11
作者:  Cong, S.;  Wu, L. H.;  Wang, Z. W.;  Li, N.;  Zhu, Z.;  Wang, F. F.;  Zhang, X.;  Wang, K.;  Xue, P.;  Ni, D. R.;  Xiao, B. L.;  Ma, Z. Y.
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
Ti alloys  Friction stir welding  Back heating assisting welding  Microstructure  Mechanical property  Corrosion resistance  
Achieving superior superplasticity in CoCrFeNiCu high entropy alloy via friction stir processing with an improved convex tool 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2023, 卷号: 873, 页码: 13
作者:  Li, N.;  Wu, L. H.;  Li, Z. K.;  Fu, H. M.;  Zhu, Z. W.;  Xue, P.;  Liu, F. C.;  Ni, D. R.;  Xiao, B. L.;  Ma, Z. Y.
收藏  |  浏览/下载：11/0  |  提交时间：2024/01/07
High entropy alloy  Friction stir processing  Superplasticity  Ultrafine grains  Grain boundary sliding  
Effects of embedded spherical pore on the tensile properties of a selective laser melted Ti6Al4V alloy 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2021, 卷号: 815, 页码: 11
作者:  Meng, L. X.;  Ben, D. D.;  Yang, H. J.;  Ji, H. B.;  Lian, D. L.;  Zhu, Y. K.;  Chen, J.;  Yi, J. L.;  Wang, L.;  Yang, J. B.;  Zhang, Z. F.
收藏  |  浏览/下载：137/0  |  提交时间：2021/10/15
Selective laser melting  Ti6Al4V  Embedded pore  Tensile strength  Elongation  
Dynamic compressive mechanical properties of the spiral tungsten wire reinforced Zr-based bulk metallic glass composites 期刊论文
COMPOSITES PART B-ENGINEERING, 2020, 卷号: 199, 页码: 10
作者:  Chen, S.;  Li, W. Q.;  Zhang, L.;  Fu, H. M.;  Li, Z. K.;  Zhu, Z. W.;  Li, H.;  Zhang, H. W.;  Wang, A. M.;  Wang, Y. D.;  Zhang, H. F.
收藏  |  浏览/下载：233/0  |  提交时间：2021/02/02
Bulk metallic glass composites  Dynamic compression  Spiral tungsten wire  Mechanical properties  
Dynamic compressive mechanical properties of the spiral tungsten wire reinforced Zr-based bulk metallic glass composites 期刊论文
COMPOSITES PART B-ENGINEERING, 2020, 卷号: 199, 页码: 10
作者:  Chen, S.;  Li, W. Q.;  Zhang, L.;  Fu, H. M.;  Li, Z. K.;  Zhu, Z. W.;  Li, H.;  Zhang, H. W.;  Wang, A. M.;  Wang, Y. D.;  Zhang, H. F.
收藏  |  浏览/下载：228/0  |  提交时间：2021/02/02
Bulk metallic glass composites  Dynamic compression  Spiral tungsten wire  Mechanical properties  
Determination of spin pumping effect in CoFeB/Ir bilayer 期刊论文
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2020, 卷号: 497, 页码: 4
作者:  Sun, Rui;  Li, Yan;  Xie, Z. K.;  Li, Yang;  Zhao, Xiao-Tian;  Liu, Wei;  Zhang, Z. D.;  Zhu, T.;  Cheng, Zhao-Hua;  He, Wei
收藏  |  浏览/下载：156/0  |  提交时间：2021/02/02
Spin pumping  Spin diffusion length  Spintronics  Heavy metal  Thin film  
Compressive mechanical properties and failure modes of Zr-based bulk metallic glass composites containing tungsten springs 期刊论文
MATERIALS & DESIGN, 2018, 卷号: 160, 页码: 652-660
作者:  Chen, S.;  Zhang, L.;  Fu, H. M.;  Li, Z. K.;  Zhu, Z. W.;  Li, H.;  Zhang, H. W.;  Wang, A. M.;  Wang, Y. D.;  Zhang, H. F.
收藏  |  浏览/下载：259/0  |  提交时间：2021/02/02
Bulk metallic glass composite  Tungsten spring  Deformation behavior  Failure mode  
Compressive mechanical properties and failure modes of Zr-based bulk metallic glass composites containing tungsten springs 期刊论文
MATERIALS & DESIGN, 2018, 卷号: 160, 页码: 652-660
作者:  Chen, S.;  Zhang, L.;  Fu, H. M.;  Li, Z. K.;  Zhu, Z. W.;  Li, H.;  Zhang, H. W.;  Wang, A. M.;  Wang, Y. D.;  Zhang, H. F.
收藏  |  浏览/下载：227/0  |  提交时间：2021/02/02
Bulk metallic glass composite  Tungsten spring  Deformation behavior  Failure mode  
Compressive mechanical properties and failure modes of Zr-based bulk metallic glass composites containing tungsten springs 期刊论文
MATERIALS & DESIGN, 2018, 卷号: 160, 页码: 652-660
作者:  Chen, S.;  Zhang, L.;  Fu, H. M.;  Li, Z. K.;  Zhu, Z. W.;  Li, H.;  Zhang, H. W.;  Wang, A. M.;  Wang, Y. D.;  Zhang, H. F.
收藏  |  浏览/下载：249/0  |  提交时间：2021/02/02
Bulk metallic glass composite  Tungsten spring  Deformation behavior  Failure mode  
Copper Bottom-up Filling for Through Silicon Via (TSV) Using Single JGB Additive 期刊论文
ECS ELECTROCHEMISTRY LETTERS, 2015, 卷号: 4, 期号: 9, 页码: D28-D30
作者:  Tang, J.;  Zhu, Q. S.;  Zhang, Y.;  Zhang, X.;  Guo, J. D.;  Shang, J. K.;  qszhu@imr.ac.cn
收藏  |  浏览/下载：130/0  |  提交时间：2016/04/21