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Study the existing form of copper (p-type oxide/segregation) and its release mechanism from the passive film of Ti-7Cu alloy 期刊论文
CORROSION SCIENCE, 2021, 卷号: 190, 页码: 14
作者:  Siddiqui, Muhammad Ali;  Ullah, Ihsan;  Kolawole, Sharafadeen Kunle;  Peng, Cong;  Wang, Jiewen;  Ren, Ling;  Yang, Ke;  Macdonald, Digby D.
收藏  |  浏览/下载：136/0  |  提交时间：2021/10/15
Ti-7Cu  Electrochemical  Segregation of Cu in the passive film  Point defect model  Quantitative analysis  ARXPS  
Effect of Cu on the passivity of Ti-xCu (x=0, 3 and 5 wt% ) alloy in phosphate-buffered saline solution within the framework of PDM-II 期刊论文
ELECTROCHIMICA ACTA, 2021, 卷号: 386, 页码: 8
作者:  Siddiqui, Muhammad Ali;  Ren, Ling;  Macdonald, Digby D.;  Yang, Ke
收藏  |  浏览/下载：116/0  |  提交时间：2021/10/15
Ti-xCu  Passivity  Electrochemical Impedance Spectroscopy  Mott-Schottky  Point Defect Model-II  
Response to Comments on E. Huttunen-Saarivirta et al., "Kinetic Properties of the Passive Film on Copper in the Presence of Sulfate-Reducing Bacteria" [J. Electrochem. Soc., 165, C450 (2018)] 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2019, 卷号: 166, 期号: 10, 页码: Y17-Y26
作者:  Huttunen-Saarivirta, E.;  Rajala, P.;  Carpen, L.;  Wang, J.;  Liu, F.;  Ghanbari, E.;  Mao, F.;  Dong, C.;  Yang, J.;  Sarifi-Asl, S.;  Macdonald, D. D.
收藏  |  浏览/下载：112/0  |  提交时间：2021/02/02
Response to Comments on E. Huttunen-Saarivirta et al., "Kinetic Properties of the Passive Film on Copper in the Presence of Sulfate-Reducing Bacteria" [J. Electrochem. Soc., 165, C450 (2018)] 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2019, 卷号: 166, 期号: 10, 页码: Y17-Y26
作者:  Huttunen-Saarivirta, E.;  Rajala, P.;  Carpen, L.;  Wang, J.;  Liu, F.;  Ghanbari, E.;  Mao, F.;  Dong, C.;  Yang, J.;  Sarifi-Asl, S.;  Macdonald, D. D.
收藏  |  浏览/下载：109/0  |  提交时间：2021/02/02