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A novel approach for the removal of oxide film to achieve seamless joining during hot-compression bonding 期刊论文
JOURNAL OF MANUFACTURING PROCESSES, 2024, 卷号: 131, 页码: 2101-2117
作者:  Zhao, Yong;  Xu, Bin;  Goel, Saurav;  Xu, Haojie;  Li, Kuo;  Zlatanovic, Danka Labus;  Sun, Mingyue;  Guo, Jiang;  Kang, Renke;  Li, Dianzhong
收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27
Vacuum  Laser treatment  Oxide film  Hot-compression bonding  Seamless joining  
Prediction and formation mechanism of serrated chips in cutting of SA508-3 steel under enhanced cooling and lubrication environments 期刊论文
TRIBOLOGY INTERNATIONAL, 2024, 卷号: 200, 页码: 17
作者:  Wang, Qinqiang;  Zhao, Yong;  Zhang, Chao;  Xu, Haojie;  Xu, Bin;  Wei, Zhaocheng;  Kang, Chengwei;  Li, Dianzhong;  Guo, Jiang
收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27
SA508-3 steel  Lubrication conditions  Critical cutting condition  Chip morphology  Material removal mechanism