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Effect of Cu/Ga interfacial reaction on heat transfer performance 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, 卷号: 34, 期号: 17, 页码: 10
作者:  Du, Xinyu;  Wang, Wendong;  Ding, Zifeng;  Wang, Xiaojing;  Qiao, Yanxin;  Wei, Song;  Zhu, Qingsheng;  Guo, Jingdong
收藏  |  浏览/下载：7/0  |  提交时间：2024/01/07
Fabrication of liquid metal/diamond hybrid thermal interface materials with high thermal conductivity and low flowability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, 卷号: 34, 期号: 18, 页码: 16
作者:  Wang, Wendong;  Wei, Song;  Du, Xinyu;  Ding, Zifeng;  Zhu, Qingsheng;  Qiao, Yanxin;  Wang, Xiaojing;  Guo, Jingdong
收藏  |  浏览/下载：8/0  |  提交时间：2024/01/08
Improving the heat conduction and mechanical properties of thermal interface materials by constructing diphase continuous structure reinforced by liquid metal 期刊论文
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2022, 卷号: 162, 页码: 7
作者:  Wei, Song;  Wang, Wendong;  Zhou, Lijun;  Guo, Jingdong
收藏  |  浏览/下载：33/0  |  提交时间：2023/05/09
Thermal properties  Microstructural analysis  Vacuum infusion  Particle-reinforcement  
Improving the heat conduction and mechanical properties of thermal interface materials by constructing diphase continuous structure reinforced by liquid metal 期刊论文
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2022, 卷号: 162, 页码: 7
作者:  Wei, Song;  Wang, Wendong;  Zhou, Lijun;  Guo, Jingdong
收藏  |  浏览/下载：32/0  |  提交时间：2023/05/09
Thermal properties  Microstructural analysis  Vacuum infusion  Particle-reinforcement