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The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509
作者:  Tian, FF;  Li, CF;  Zhou, M;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：132/0  |  提交时间：2018/06/05
Heterogeneous Binary-systems  Chemical-compound Layers  2 Elementary Substances  Eutectic Snin Solder  Intermetallic Compounds  Phase Identification  Reaction-diffusion  Growth-kinetics  Joint  Transformations  
Phase transformation between Cu(In,Sn)(2) and Cu-2(In,Sn) compounds formed on single crystalline Cu substrate during solid state aging 期刊论文
Journal of Applied Physics, 2014, 卷号: 115, 期号: 4
作者:  F. F. Tian;  Z. Q. Liu;  J. D. Guo
收藏  |  浏览/下载：116/0  |  提交时间：2014/04/18
Heterogeneous Binary-systems  2 Elementary Substances  Intermetallic  Compounds  Reaction-diffusion  Growth  Layers  Interface  Solders  Joints  Cu3sn