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CPA descriptions of random Cu-Au alloys in comparison with SQS approach 期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2017, 卷号: 128, 页码: 302-309
作者:  Tian, Li-Yun;  Ye, Li-Hua;  Hu, Qing-Miao;  Lu, Song;  Zhao, Jijun;  Vitos, Levente;  Tian, LY (reprint author), Royal Inst Technol, Dept Mat Sci & Engn, Appl Mat Phys, SE-10044 Stockholm, Sweden.
收藏  |  浏览/下载：123/0  |  提交时间：2017/08/17
Local Lattice Distortion  Formation Enthalpy  Elastic Constant  Special Quasi-random Structure (Sqs)  Cu-au Alloys  
The effect of long-range order on the elastic properties of Cu3Au 期刊论文
Journal of Physics-Condensed Matter, 2013, 卷号: 25, 期号: 8
作者:  G. S. Wang;  E. K. Delczeg-Czirjak;  Q. M. Hu;  K. Kokko;  B. Johansson;  L. Vitos
收藏  |  浏览/下载：113/0  |  提交时间：2013/12/24
Coherent-potential Approximation  Au-cu Alloys  Mg Alloys  Constants  Energy  Metals  Gold  Transition  Pressure  Model  
Geometries, stabilities, and electronic properties of Pt-group-doped gold clusters, their relationship to cluster size, and comparison with pure gold clusters 期刊论文
Physical Chemistry Chemical Physics, 2011, 卷号: 13, 期号: 21, 页码: 10119-10130
作者:  S. J. Wang;  X. Y. Kuang;  C. Lu;  Y. F. Li;  Y. R. Zhao
Adobe PDF(3412Kb)  |  收藏  |  浏览/下载：165/0  |  提交时间：2012/04/13
Effective Core Potentials  Density-functional Theory  Ab-initio  Molecular Calculations  Photoelectron-spectroscopy  Au  Ni  Alloys  Anions  Cu  
Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 487, 期号: 1-2, 页码: 776-780
作者:  X. F. Zhang;  J. D. Guo;  J. K. Shang
Adobe PDF(759Kb)  |  收藏  |  浏览/下载：87/0  |  提交时间：2012/04/13
Intermetallics  Kinetics  Interfacial Reactions  Feni  Activation Energy  Zn Based Solders  Ni-p/au Layer  Interfacial Reactions  Sn-ag  Cu  Electromigration  Interconnect  Microstructure  Substrate  Alloys