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Research Progress in Preparation and Purification of Rare Earth Metals 期刊论文
METALS, 2020, 卷号: 10, 期号: 10, 页码: 13
Authors:  Liu, Hang;  Zhang, Yao;  Luan, Yikun;  Yu, Huimin;  Li, Dianzhong
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rare earth metals  purity  impurity concentration  preparation  purification  
Research Progress in Preparation and Purification of Rare Earth Metals 期刊论文
METALS, 2020, 卷号: 10, 期号: 10, 页码: 13
Authors:  Liu, Hang;  Zhang, Yao;  Luan, Yikun;  Yu, Huimin;  Li, Dianzhong
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rare earth metals  purity  impurity concentration  preparation  purification  
The open-pin failure of power device under the combined effect of thermo-migration and electro-migration 期刊论文
Chinese Science Bulletin, 2020, 卷号: 65, 期号: 20, 页码: 2169-2177
Authors:  Gao Liyin;  Li Caifu;  Cao Lihua;  Liu Zhiquan
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Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 4, 页码: 2967-2975
Authors:  Du, Yahong;  Gao, Li-Yin;  Yu, Daquan;  Liu, Zhi-Quan
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Reliability issues of lead-free solder joints in electronic devices 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
Authors:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-Quan;  Sun, Lei;  Long, Wei-Min;  He, Peng;  Xiong, Ming-Yue;  Zhao, Meng
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Lead-free solder  reliability  IMC  crack  failure  
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
Authors:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD;  Zhang, L;  Zhu, QS (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
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Stress-relaxation  Void Formation  Electromigration  Reliability  Sn  Interconnections  Thermomigration  Metallization  Mechanisms  Diffusion  
Electromigration anisotropy introduced by tin orientation in solder joints 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 703, 页码: 264-271
Authors:  Chen, Jian-Qiang;  Liu, Kai-Lang;  Guo, Jing-Dong;  Ma, Hui-Cai;  Wei, Song;  Shang, Jian-Ku;  Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
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Electromigration  Single Crystal Tin  Cu6sn5  Intermetallic Compounds  Orientation  Diffusion  
Cu6Sn5 intermetallic compound anisotropy introduced by single crystal Sn under current stress 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 695, 页码: 3290-3298
Authors:  Chen, Jian-Qiang;  Guo, Jing-Dong;  Ma, Hui-Cai;  Wei, Song;  Shang, Jian-Ku;  Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
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Cu6sn5  Tin  Orientation  Solid State Reaction  Electromigration  
Factors Influencing Passivity Breakdown on UNS N08800 in Neutral Chloride and Thiosulfate Solutions 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2017, 卷号: 164, 期号: 4, 页码: C94-C103
Authors:  Wu, Sibo;  Wang, Jianqiu;  Song, Shizhe;  Xia, Da-Hai;  Zhang, Zhiming;  Gao, Zhiming;  Wang, Jihui;  Jin, Weixian;  Hu, Wenbin
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A general strategy for the ultrafast surface modification of metals 期刊论文
NATURE COMMUNICATIONS, 2016, 卷号: 7, 页码: 6
Authors:  Shen, Mingli;  Zhu, Shenglong;  Wang, Fuhui
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