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Research Progress in Preparation and Purification of Rare Earth Metals
期刊论文
METALS, 2020, 卷号: 10, 期号: 10, 页码: 13
Authors:
Liu, Hang
;
Zhang, Yao
;
Luan, Yikun
;
Yu, Huimin
;
Li, Dianzhong
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Submit date:2021/02/02
rare earth metals
purity
impurity concentration
preparation
purification
Research Progress in Preparation and Purification of Rare Earth Metals
期刊论文
METALS, 2020, 卷号: 10, 期号: 10, 页码: 13
Authors:
Liu, Hang
;
Zhang, Yao
;
Luan, Yikun
;
Yu, Huimin
;
Li, Dianzhong
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View/Download:167/0
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Submit date:2021/02/02
rare earth metals
purity
impurity concentration
preparation
purification
The open-pin failure of power device under the combined effect of thermo-migration and electro-migration
期刊论文
Chinese Science Bulletin, 2020, 卷号: 65, 期号: 20, 页码: 2169-2177
Authors:
Gao Liyin
;
Li Caifu
;
Cao Lihua
;
Liu Zhiquan
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Submit date:2021/02/03
Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 4, 页码: 2967-2975
Authors:
Du, Yahong
;
Gao, Li-Yin
;
Yu, Daquan
;
Liu, Zhi-Quan
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Submit date:2021/02/03
Reliability issues of lead-free solder joints in electronic devices
期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
Authors:
Jiang, Nan
;
Zhang, Liang
;
Liu, Zhi-Quan
;
Sun, Lei
;
Long, Wei-Min
;
He, Peng
;
Xiong, Ming-Yue
;
Zhao, Meng
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Submit date:2021/02/02
Lead-free solder
reliability
IMC
crack
failure
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
Authors:
Zhu, QS
;
Gao, F
;
Ma, HC
;
Liu, ZQ
;
Guo, JD
;
Zhang, L
;
Zhu, QS (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
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Submit date:2018/06/05
Stress-relaxation
Void Formation
Electromigration
Reliability
Sn
Interconnections
Thermomigration
Metallization
Mechanisms
Diffusion
Electromigration anisotropy introduced by tin orientation in solder joints
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 703, 页码: 264-271
Authors:
Chen, Jian-Qiang
;
Liu, Kai-Lang
;
Guo, Jing-Dong
;
Ma, Hui-Cai
;
Wei, Song
;
Shang, Jian-Ku
;
Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
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Submit date:2017/08/17
Electromigration
Single Crystal Tin
Cu6sn5
Intermetallic Compounds
Orientation
Diffusion
Cu6Sn5 intermetallic compound anisotropy introduced by single crystal Sn under current stress
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 695, 页码: 3290-3298
Authors:
Chen, Jian-Qiang
;
Guo, Jing-Dong
;
Ma, Hui-Cai
;
Wei, Song
;
Shang, Jian-Ku
;
Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
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Submit date:2017/08/17
Cu6sn5
Tin
Orientation
Solid State Reaction
Electromigration
Factors Influencing Passivity Breakdown on UNS N08800 in Neutral Chloride and Thiosulfate Solutions
期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2017, 卷号: 164, 期号: 4, 页码: C94-C103
Authors:
Wu, Sibo
;
Wang, Jianqiu
;
Song, Shizhe
;
Xia, Da-Hai
;
Zhang, Zhiming
;
Gao, Zhiming
;
Wang, Jihui
;
Jin, Weixian
;
Hu, Wenbin
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Submit date:2021/02/02
A general strategy for the ultrafast surface modification of metals
期刊论文
NATURE COMMUNICATIONS, 2016, 卷号: 7, 页码: 6
Authors:
Shen, Mingli
;
Zhu, Shenglong
;
Wang, Fuhui
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Submit date:2021/02/02