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The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509
作者:  Tian, FF;  Li, CF;  Zhou, M;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载:130/0  |  提交时间:2018/06/05
Heterogeneous Binary-systems  Chemical-compound Layers  2 Elementary Substances  Eutectic Snin Solder  Intermetallic Compounds  Phase Identification  Reaction-diffusion  Growth-kinetics  Joint  Transformations  
Phase transformation between Cu(In,Sn)(2) and Cu-2(In,Sn) compounds formed on single crystalline Cu substrate during solid state aging 期刊论文
Journal of Applied Physics, 2014, 卷号: 115, 期号: 4
作者:  F. F. Tian;  Z. Q. Liu;  J. D. Guo
收藏  |  浏览/下载:115/0  |  提交时间:2014/04/18
Heterogeneous Binary-systems  2 Elementary Substances  Intermetallic  Compounds  Reaction-diffusion  Growth  Layers  Interface  Solders  Joints  Cu3sn  
Simulation study of effects of initial particle size distribution on dissolution 期刊论文
Acta Materialia, 2009, 卷号: 57, 期号: 2, 页码: 316-325
作者:  G. Wang;  D. S. Xu;  N. Ma;  N. Zhou;  E. J. Payton;  R. Yang;  M. J. Mills;  Y. Wang
Adobe PDF(842Kb)  |  收藏  |  浏览/下载:106/0  |  提交时间:2012/04/13
Kinetics  Dissolution  Modeling  Phase Field Models  Nickel Alloys  Phase-field Model  Increasing Length Scale  Computer-simulation  Grain-growth  Microstructural Evolution  Binary-alloys  Ni-al  Unequal  Conductivities  Ordered Intermetallics  Anisotropic Systems  
A thermodynamic assessment of the copper-gallium system 期刊论文
Calphad-Computer Coupling of Phase Diagrams and Thermochemistry, 2008, 卷号: 32, 期号: 2, 页码: 447-453
作者:  J. B. Li;  L. Ji;  J. K. Liang;  Y. Zhang;  J. Luo;  C. R. Lic;  G. H. Rao
Adobe PDF(632Kb)  |  收藏  |  浏览/下载:72/0  |  提交时间:2012/04/13
Cu-ga System  Thermodynamic Properties  Phase Diagram  Calphad  Ag-ga System  Solid Solutions  Binary-systems  Cu-ga  Alloys  Silver  Elements  Gold