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Effect of transient liquid phase (TLP) bonding on the ductility of a Ni-base single crystal superalloy in a stress rupture test 期刊论文
Materials Characterization, 2008, 卷号: 59, 期号: 1, 页码: 68-73
作者:  J. D. Liu;  T. Jin;  N. R. Zhao;  Z. H. Wang;  X. F. Sun;  H. R. Guan;  Z. Q. Hu
Adobe PDF(1404Kb)  |  收藏  |  浏览/下载:102/0  |  提交时间:2012/04/13
Ni-based Single Crystal  Superalloy  Tlp Bonding  Stress Rupture  Properties  Ductility  Creep-behavior  Interlayer Alloy  Cast Alloy-718  Heat-treatment  Microstructure  Boron