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Enhancing fatigue strength of high-strength ultrafine-scale Cu/Ni laminated composites 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2018, 卷号: 714, 页码: 43-48
作者:  Wang, YC;  Liang, F;  Tan, HF;  Zhang, B;  Zhang, GP;  Zhang, GP (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载:188/0  |  提交时间:2018/06/05
Dissimilar Elastic-materials  High-cycle Fatigue  Mems Thin-films  Crack Deflection  Copper-films  Nanocrystalline Metals  Length-scale  Liga Nickel  Behavior  Fine  
Nanotwin-assisted grain growth in nanocrystalline gold films under cyclic loading 期刊论文
Nature Communications, 2014, 卷号: 5
作者:  X. M. Luo;  X. F. Zhu;  G. P. Zhang
收藏  |  浏览/下载:142/0  |  提交时间:2014/03/14
Molecular-dynamics Simulation  Thin Copper-films  Boundary Migration  Fatigue Behavior  Insitu Observations  Room-temperature  Length-scale  Deformation  Al  Dislocation  
Geometrical Scale-Sensitive Fatigue Properties of Ti-6.5Al-3.5Mo-1.5Zr-0.3Si Alloys With alpha/beta Lamellar Microstructures 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 12, 页码: 1284-1288
作者:  B.;  Song Zhang, Z. M.;  Lei, L. M.;  Kang, L.;  Zhang, G. P.
收藏  |  浏览/下载:112/0  |  提交时间:2015/05/08
Fatigue  Ti Alloy  Microstructure  Size Effect  Thin Copper  Titanium-alloys  Cycle Fatigue  Crack Growth  Foils  Ti-6al-4v  Films  Wires  Size  
Repeated Growth-Etching-Regrowth for Large-Area Defect-Free Single-Crystal Graphene by Chemical Vapor Deposition 期刊论文
Acs Nano, 2014, 卷号: 8, 期号: 12, 页码: 12806-12813
作者:  T.;  Ren Ma, W. C.;  Liu, Z. B.;  Huang, L.;  Ma, L. P.;  Ma, X. L.;  Zhang, Z. Y.;  Peng, L. M.;  Cheng, H. M.
收藏  |  浏览/下载:120/0  |  提交时间:2015/05/08
Graphene  Single Crystal  Large Size  Defect Free  Chemical Vapor  Deposition  Thin Carbon-films  Grain-boundaries  Polycrystalline Graphene  Controllable Synthesis  Monolayer Graphene  Bilayer Graphene  Copper  Surface  Strength  Graphitization  Hydrogen  
Mechanical annealing of Cu-Si nanowires during high-cycle fatigue 期刊论文
Mrs Communications, 2014, 卷号: 4, 期号: 3, 页码: 83-87
作者:  C. Ensslen;  O. Kraft;  R. Monig;  J. Xu;  G. P. Zhang;  R. Schneider
收藏  |  浏览/下载:109/0  |  提交时间:2015/01/14
Nanocrystalline Copper  Plastic-deformation  Thin Copper  Nanowhiskers  Behavior  Crystals  Metals  Scale  Films  Wires  
Fatigue Damage Behavior of Freestanding 40 mu m-Thick Nickel Foils for MEMS Applications 期刊论文
Advanced Engineering Materials, 2013, 卷号: 15, 期号: 6, 页码: 496-502
作者:  J. Xu;  G. P. Zhang
收藏  |  浏览/下载:131/0  |  提交时间:2013/12/24
Crack Initiation  Thin Copper  Films  
Structural properties of epitaxial SrCuO2 thin films on SrTiO3 (001) substrates 期刊论文
THIN SOLID FILMS, 2011, 卷号: 519, 期号: 7, 页码: 2071-2074
作者:  Mi, Shao-Bo
收藏  |  浏览/下载:77/0  |  提交时间:2021/02/02
Thin films  Interface structure  Transmission electron microscopy  Strontium copper oxide  Sputtering  
Size effects on tensile and fatigue behaviour of polycrystalline metal foils at the micrometer scale 期刊论文
Philosophical Magazine, 2011, 卷号: 91, 期号: 6, 页码: 932-945
作者:  C. Y. Dai;  G. P. Zhang;  C. Yan
Adobe PDF(2322Kb)  |  收藏  |  浏览/下载:154/0  |  提交时间:2012/04/13
Copper Foil  Tensile Test  Fatigue  Size Effect  Micrometer Scale  Thin Copper-films  Cu Foils  Strength  Strain  Wires  
Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating 期刊论文
Journal of Materials Science-Materials in Electronics, 2011, 卷号: 22, 期号: 9, 页码: 1234-1238
作者:  C. Chen;  L. Zhang;  Q. Q. Lai;  C. F. Li;  J. K. Shang
Adobe PDF(398Kb)  |  收藏  |  浏览/下载:96/0  |  提交时间:2012/04/13
Thin-films  Sn-ag  Alloy  Cu  Systems  Fe-42ni  Copper  Ni  Intermetallics  Solderability  
Electrodeposition of high corrosion resistance Cu/Ni-P coating on AZ91D magnesium alloy 期刊论文
Applied Surface Science, 2011, 卷号: 257, 期号: 21, 页码: 9213-9220
作者:  S. Zhang;  F. H. Cao;  L. R. Chang;  J. J. Zheng;  Z. Zhang;  J. Q. Zhang;  C. A. Cao
Adobe PDF(1683Kb)  |  收藏  |  浏览/下载:130/0  |  提交时间:2012/04/13
Az91d Mg Alloy  Electrodeposition  Ni-p  Corrosion Resistance  Phosphorus Incorporation  Pure Magnesium  Thin-films  Ni  Pretreatment  Deposits  Behavior  Copper