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Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density 期刊论文
MICROELECTRONICS RELIABILITY, 2023, 卷号: 146, 页码: 8
作者:  Zhu, Qing-Sheng;  Ding, Zi-Feng;  Wei, Xiang-Fu;  Guo, Jing-dong;  Wang, Xiao-Jing
收藏  |  浏览/下载：8/0  |  提交时间：2024/01/07
Copper pillar bump  Cu electroplating  Leveler  Interfacial voids  Chip packaging  
Nano-scale twinned Cu with ultrahigh strength prepared by direct current electrodeposition 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 758, 页码: 1-6
作者:  Li, Sujie;  Zhu, Qingsheng;  Zheng, Boda;  Yuan, Jie;  Wang, Xiaojing
收藏  |  浏览/下载：143/0  |  提交时间：2021/02/02
Electroplating Cu  Gelatin  Equiaxed microstructure  Twinning