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Interface healing mechanism of fine-grained Ni-Co-based superalloy during hot-compression bonding 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2024, 卷号: 173, 页码: 45-53
作者:  Ren, Shaofei;  Bai, Xiaolong;  Liu, Sheng;  Sun, Mingyue;  Xu, Bin;  Cui, Chuanyong
收藏  |  浏览/下载：7/0  |  提交时间：2024/01/08
Hot-compression bonding  Ni-Co-based superalloy  Discontinuous dynamic recrystallization  Heterogeneous epitaxial recrystallization