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Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 4, 页码: 9
作者:  Tian, Feifei;  Pang, Xueyong;  Xu, Bo;  Liu, Zhi-Quan
收藏  |  浏览/下载：108/0  |  提交时间：2021/02/02
In-48Sn solder  polycrystalline Cu  Cu-2(In  Sn)  growth orientation  
Fast simulations of a large number of crystals growth in centimeter-scale during alloy solidification via nonlinearly preconditioned quantitative phase-field formula 期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2018, 卷号: 147, 页码: 338-352
作者:  Gong, TZ;  Chen, Y;  Cao, YF;  Kang, XH;  Li, DZ;  Chen, Y (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：198/0  |  提交时间：2018/06/05
X-ray Radiography  Adaptive Mesh Refinement  Sample Directional Solidification  Al-cu Alloy  Dendritic Growth  Polycrystalline Solidification  Efficient Computation  Initial Transient  Model  Microstructures  
INVESTIGATIONS ON THERMAL STABILITY OF FATIGUE DISLOCATION STRUCTURES IN A DOUBLE-SLIP-ORIENTED Cu SINGLE CRYSTAL 期刊论文
ACTA METALLURGICA SINICA, 2013, 卷号: 49, 期号: 1, 页码: 107-114
作者:  Guo Weiwei;  Qi Chengjun;  Li Xiaowu
收藏  |  浏览/下载：113/0  |  提交时间：2021/02/02
CHANNELING CONTRAST TECHNIQUE  CYCLIC DEFORMATION-BEHAVIOR  POLYCRYSTALLINE COPPER  ANNEALING TWINS  SEM  ORIENTATION  AMPLITUDE  METALS  BANDS  Cu single crystal  fatigue dislocation structure  thermal stability  recrystallization  annealing twin  
Cyclic deformation and fatigue cracking behaviour of polycrystalline Cu, Cu-10 wt% Zn and Cu-32 wt% Zn 期刊论文
Philosophical Magazine, 2008, 卷号: 88, 期号: 16, 页码: 2487-2503
作者:  P. Zhang;  Q. Q. Duan;  S. X. Li;  Z. F. Zhang
Adobe PDF(3065Kb)  |  收藏  |  浏览/下载：80/0  |  提交时间：2012/04/13
Polycrystalline Copper  Cu-zn Alloys  Cyclic Deformation  Slip Bands  Grain Boundary  Twin Boundary  Fatigue Cracking  Stress-strain Response  Copper Single-crystals  Perpendicular  Grain-boundary  Annealing Twin Boundaries  Persistent Slip Bands  Cu-22-percent-zn Alloy  Dislocation-structures  Bicrystals  Initiation  Amplitude  
Dislocation evolution in twins of cyclically deformed copper 期刊论文
Philosophical Magazine Letters, 2005, 卷号: 85, 期号: 12, 页码: 613-623
作者:  X. L. Guo;  L. Lu;  S. X. Li
收藏  |  浏览/下载：90/0  |  提交时间：2012/04/14
High Cycle Fatigue  Substructure Evolution  Polycrystalline Copper  Low-amplitude  Grain-size  Deformation  Microstructures  Boundaries  Cu  Stresses  
The effect of doping Ag on the microstructure of La2/3Sr1/3MnO3 films 期刊论文
Journal of Materials Research, 2002, 卷号: 17, 期号: 10, 页码: 2712-2719
作者:  Q. Zhan;  R. Yu;  L. L. He;  D. X. Li;  J. Li;  C. K. Ong
收藏  |  浏览/下载：76/0  |  提交时间：2012/04/14
Yba2cu3o7-delta Thin-films  Low-field Magnetoresistance  Perovskite  Manganite Films  Giant Magnetoresistance  Grain-boundaries  In-situ  Silver  Growth  Polycrystalline