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期刊论文 [10]
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资助项目:National Key Research and Development Program of China[2016YFB0300205]
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Inhibition efficiency of 304-Cu stainless steel against oral bacterial biofilm
期刊论文
JOURNAL OF APPLIED BIOMATERIALS & FUNCTIONAL MATERIALS, 2022, 卷号: 20, 页码: 11
作者:
Lan, Yiliang
;
Yang, Jie
;
Liu, Xianbo
;
Zhao, Hanyu
;
Zhang, Xinrui
;
Yin, Xueliang
;
Yang, Chunguang
;
Yang, Ke
;
Liu, Yi
收藏
  |  
浏览/下载:125/0
  |  
提交时间:2022/07/01
Copper-bearing stainless steel
S
mutans
S
sanguinis
cytotoxicity
corrosion resistance
Antibacterial mechanism of Cu-bearing 430 ferritic stainless steel
期刊论文
RARE METALS, 2021, 页码: 11
作者:
Zhang, Zhuang
;
Zhang, Xin-Rui
;
Jin, Tao
;
Yang, Chun-Guang
;
Sun, Yu-Peng
;
Li, Qi
;
Yang, Ke
收藏
  |  
浏览/下载:134/0
  |  
提交时间:2021/10/15
Cu-bearing stainless steel
Corrosion resistance
Antibacterial mechanism
Contact killing
Copper ions
Reactive oxygen species (ROS)
Improved corrosion resistance and biofilm inhibition ability of copper-bearing 304 stainless steel against oral microaerobic Streptococcus mutans
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2021, 卷号: 66, 页码: 112-120
作者:
Zhao, Hanyu
;
Sun, Yupeng
;
Yin, Lu
;
Yuan, Zhao
;
Lan, Yiliang
;
Xu, Dake
;
Yang, Chunguang
;
Yang, Ke
收藏
  |  
浏览/下载:163/0
  |  
提交时间:2021/03/15
304-Cu stainless steel
Microbiologically influenced corrosion
Streptococcus mutans
Biofilm
Interfacial segregation and precipitation behavior of Cu-rich precipitates in Cu-bearing 316LN stainless steel after aging at different temperatures
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2021, 卷号: 805, 页码: 8
作者:
Xi, Tong
;
Zhang, Xinrui
;
Yin, Xueliang
;
Yang, Chunguang
;
Yang, Ke
收藏
  |  
浏览/下载:125/0
  |  
提交时间:2021/10/15
Copper precipitation
Mechanical property
316LN stainless Steel
Interfacial segregation
Atom probe tomography
Enhancement of strength and ductility by Cu-rich precipitation in Cu-bearing 304L austenitic stainless steel
期刊论文
MATERIALS LETTERS, 2020, 卷号: 272, 页码: 4
作者:
Yuan, Zhao
;
Xi, Tong
;
Yang, Chunguang
;
Zhao, Hanyu
;
Yang, Ke
收藏
  |  
浏览/下载:127/0
  |  
提交时间:2021/02/02
Metals and alloys
Microstructure
Deformation
Cu-rich precipitate
Enhancement of strength and ductility by Cu-rich precipitation in Cu-bearing 304L austenitic stainless steel
期刊论文
MATERIALS LETTERS, 2020, 卷号: 272, 页码: 4
作者:
Yuan, Zhao
;
Xi, Tong
;
Yang, Chunguang
;
Zhao, Hanyu
;
Yang, Ke
收藏
  |  
浏览/下载:148/0
  |  
提交时间:2021/02/02
Metals and alloys
Microstructure
Deformation
Cu-rich precipitate
Investigation on Corrosion Resistance of Welded Cu-Bearing 304L Stainless Steel AgainstPseudomonas aeruginosa
期刊论文
FRONTIERS IN MATERIALS, 2020, 卷号: 7, 页码: 11
作者:
Yin, Lu
;
Xi, Tong
;
Yang, Chunguang
;
Zhao, Jinlong
;
Sun, Yupeng
;
Zhao, Hanyu
;
Yang, Ke
收藏
  |  
浏览/下载:175/0
  |  
提交时间:2021/02/02
Cu-bearing stainless steels
tungsten inert gas welding
microbiologically influenced corrosion
confocal laser scanning microscopy
pitting corrosion
Investigation on Corrosion Resistance of Welded Cu-Bearing 304L Stainless Steel AgainstPseudomonas aeruginosa
期刊论文
FRONTIERS IN MATERIALS, 2020, 卷号: 7, 页码: 11
作者:
Yin, Lu
;
Xi, Tong
;
Yang, Chunguang
;
Zhao, Jinlong
;
Sun, Yupeng
;
Zhao, Hanyu
;
Yang, Ke
收藏
  |  
浏览/下载:139/0
  |  
提交时间:2021/02/02
Cu-bearing stainless steels
tungsten inert gas welding
microbiologically influenced corrosion
confocal laser scanning microscopy
pitting corrosion
Contact Killing of Cu-Bearing Stainless Steel Based on Charge Transfer Caused by the Microdomain Potential Difference
期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2020, 卷号: 12, 期号: 1, 页码: 361-372
作者:
Zhang, Xinrui
;
Yang, Chunguang
;
Yang, Ke
收藏
  |  
浏览/下载:151/0
  |  
提交时间:2021/02/02
Cu-bearing stainless steel
contact killing
charge transfer
surface potential
Cu(I)
Cu(II)
Contact Killing of Cu-Bearing Stainless Steel Based on Charge Transfer Caused by the Microdomain Potential Difference
期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2020, 卷号: 12, 期号: 1, 页码: 361-372
作者:
Zhang, Xinrui
;
Yang, Chunguang
;
Yang, Ke
收藏
  |  
浏览/下载:159/0
  |  
提交时间:2021/02/02
Cu-bearing stainless steel
contact killing
charge transfer
surface potential
Cu(I)
Cu(II)