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Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects 期刊论文
JOURNAL OF MATERIALS RESEARCH, 2015, 卷号: 30, 期号: 8, 页码: 1065-1071
Authors:  Chen, Jian-Qiang;  Guo, Jing-Dong;  Ma, Hui-Cai;  Liu, Kai-Lang;  Zhu, Qing-sheng;  Shang, Jian Ku;  jdguo@imr.ac.cn
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