| Interfacial reaction between eutectic Sn-58Bi lead-free solder and electroless Ni-P plating | |
| Li, F; Liu, CZ; Xian, AP; Shang, JK | |
| Corresponding Author | Xian, AP() |
| 2004-08-01 | |
| Source Publication | ACTA METALLURGICA SINICA
 |
| ISSN | 0412-1961 |
| Volume | 40Issue:8Pages:815-821 |
| Abstract | Interfacial reactions between eutectic Sn-58Bi lead-free solder and Cu or electroless Ni-P plating were studied. The joining temperature was 180 degreesC, the aging temperature was 60120 degreesC, and the aging time was 5 to 30 d. The interfacial reaction products determined by SEM, EDAX and XRD are Cu6Sn5 on the solder/Cu interface, and Ni3Sn4 on the solder/Ni-P interface. In addition, there is a P-rich layer between Ni3Sn4 and Ni.layer. The growth rate Of Cu6Sn5 is much faster than that of Ni3Sn4. The growth rate of Ni3Sn4 was found to decrease with increasing P content in the electroless Ni-P plating. The kinetics of the intermetallic compound growth follows a parabolic law of time, as controlled by the diffusion mechanism. The apparent activation energies are 90.87 kJ/mol for the growth Of Cu6Sn5, 101.43 kJ/mol for Ni3Sn4 on Ni-9%P plating and 117.31 kJ/mol for Ni3Sn4 On Ni-16%P plate, respectively. |
| Keyword | Sn-Bi alloy lead-free solder interfacial reaction intermetallic compound electroless Ni-P plating |
| Indexed By | SCI |
| Language | 英语 |
| WOS Research Area | Metallurgy & Metallurgical Engineering |
| WOS Subject | Metallurgy & Metallurgical Engineering |
| WOS ID | WOS:000223695400007 |
| Publisher | SCIENCE CHINA PRESS |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/119785 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Xian, AP |
| Affiliation | 1.Chinese Acad Sci, Met Res Inst, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA |
| Recommended Citation GB/T 7714 | Li, F,Liu, CZ,Xian, AP,et al. Interfacial reaction between eutectic Sn-58Bi lead-free solder and electroless Ni-P plating[J]. ACTA METALLURGICA SINICA,2004,40(8):815-821. |
| APA | Li, F,Liu, CZ,Xian, AP,&Shang, JK.(2004).Interfacial reaction between eutectic Sn-58Bi lead-free solder and electroless Ni-P plating.ACTA METALLURGICA SINICA,40(8),815-821. |
| MLA | Li, F,et al."Interfacial reaction between eutectic Sn-58Bi lead-free solder and electroless Ni-P plating".ACTA METALLURGICA SINICA 40.8(2004):815-821. |
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