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High-quality dissimilar friction stir welding of Al to steel with no contacting between tool and steel plate 期刊论文
MATERIALS CHARACTERIZATION, 2022, 卷号: 191, 页码: 7
Authors:  Zhang, M.;  Wang, Y. D.;  Xue, P.;  Zhang, H.;  Ni, D. R.;  Wang, K. S.;  Ma, Z. Y.
Favorite  |  View/Download：79/0  |  Submit date：2022/09/16
Friction stir welding  Dissimilar joint  Thickness difference  Interface  Intermetallic compound  
Study on the micro-interface behavior of 2024Al light alloy bonded by ultrasonic assisted solid phase diffusion welding with Ag interlayer under atmosphere 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 卷号: 833, 页码: 10
Authors:  Wang, Qian;  Nie, Yong;  Shao, Yingfeng;  Liu, Hongzhi;  Hu, Xiaoqiang;  Li, Dianzhong
Favorite  |  View/Download：36/0  |  Submit date：2022/07/01
Ultrasound  Solid phase welding  Plastic deformation  Amorphous  Intermetallic compound  
Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints 期刊论文
MATERIALS CHARACTERIZATION, 2021, 卷号: 178, 页码: 8
Authors:  Gao, Li-Yin;  Luo, Yi-Xiu;  Wan, Peng;  Liu, Zhi-Quan
Favorite  |  View/Download：188/0  |  Submit date：2021/10/15
Solder joint  Intermetallic compound  Mechanical property  Nano-indentation  First principle calculation  
High performance and low thermal expansion in Er-Fe-V-Mo dual-phase alloys 期刊论文
ACTA MATERIALIA, 2020, 卷号: 198, 页码: 271-280
Authors:  Lin, Kun;  Li, Wenjie;  Yu, Chengyi;  Jiang, Suihe;  Cao, Yili;  Li, Qiang;  Chen, Jun;  Zhang, Minghe;  Xia, Min;  Chen, Yan;  An, Ke;  Li, Xiaobing;  Zhang, Qinghua;  Gu, Lin;  Xing, Xianran
Favorite  |  View/Download：85/0  |  Submit date：2021/02/02
Low thermal expansion  Magnetovolume effect  Crystal structure  Neutron diffraction  Mechanical properties  Intermetallic compound  
High performance and low thermal expansion in Er-Fe-V-Mo dual-phase alloys 期刊论文
ACTA MATERIALIA, 2020, 卷号: 198, 页码: 271-280
Authors:  Lin, Kun;  Li, Wenjie;  Yu, Chengyi;  Jiang, Suihe;  Cao, Yili;  Li, Qiang;  Chen, Jun;  Zhang, Minghe;  Xia, Min;  Chen, Yan;  An, Ke;  Li, Xiaobing;  Zhang, Qinghua;  Gu, Lin;  Xing, Xianran
Favorite  |  View/Download：87/0  |  Submit date：2021/02/02
Low thermal expansion  Magnetovolume effect  Crystal structure  Neutron diffraction  Mechanical properties  Intermetallic compound  
Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process 期刊论文
METALS AND MATERIALS INTERNATIONAL, 2020, 卷号: 26, 期号: 3, 页码: 333-345
Authors:  Hua, Fu-an;  Song, Hong-wu;  Sun, Tao;  Li, Jian-ping
Favorite  |  View/Download：72/0  |  Submit date：2021/02/02
Bimetal  Cold roll bonding  Intermetallic compound  Growth kinetics  Inter-diffusion  
Microstructure-based modeling of IMC layer thickness effect on tensile behavior of Cu/Al clad strip 期刊论文
Materials Research Express, 2020, 卷号: 7, 期号: 1
Authors:  Sun,Tao;  Song,Hong-wu;  Hua,Fu-an;  Li,Jian-ping
Favorite  |  View/Download：100/0  |  Submit date：2021/02/02
clad strip  cold roll bonding  intermetallic compound  tensile property  microstructure-based modeling  
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
Authors:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
Favorite  |  View/Download：176/0  |  Submit date：2021/02/02
alloy element  Sn-Ag-Cu solder  intermetallic compound  interfacial morphology  shear strength  
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
Authors:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
Favorite  |  View/Download：73/0  |  Submit date：2021/02/02
62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
Authors:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
Favorite  |  View/Download：69/0  |  Submit date：2021/02/02
62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling