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Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC
Zhang, Liang1,2; Liu, Zhi-quan2; Yang, Fan1; Zhong, Su-juan3
Corresponding AuthorZhang, Liang(zhangliang@jsnu.edu.cn)
2017
Source PublicationSOLDERING & SURFACE MOUNT TECHNOLOGY
ISSN0954-0911
Volume29Issue:3Pages:151-155
AbstractPurpose - This paper aims to investigate Cu/SnAgCu/Cu transient liquid phase (TLP) bonding with different thicknesses for three-dimensional (3D) integrated circuit (IC). Design/methodology/approach - This paper includes experiments and finite element simulation. Findings - The growth rate of the intermetallic compound layer during TLP soldering was calculated to be 0.6 mu m/s, and the small scallop-type morphology Cu6Sn5 grains can be observed. With the decrease in thickness in solder joint, the thickness of intermetallic compounds represents the same size and morphology, but the size of eutectic particles (Ag3Sn, Cu6Sn5) in the matrix microstructure decrease obviously. It is found that with the increase in thickness, the tensile strength drops obviously. Based on finite element simulation, the smaller value of von Mises demonstrated that the more reliability of lead-free solder joints in 3D IC. Originality/value -The Cu/SnAgCu/Cu TLP bonding with different thicknesses for 3D IC was investigated.
KeywordAlloys Sn-Ag-Cu Finite element modeling (FEM) Reliability
Funding OrganizationNatural Science Foundation of China ; Qing Lan Project ; China Postdoctoral Science Foundation ; State Foundation of Laboratory of Advanced Brazing Filler Metals and Technology (Zhengzhou Research Institute of Mechanical Engineering)
DOI10.1108/SSMT-07-2016-0015
Indexed BySCI
Language英语
Funding ProjectNatural Science Foundation of China[51475220] ; Qing Lan Project ; China Postdoctoral Science Foundation[2016M591464] ; State Foundation of Laboratory of Advanced Brazing Filler Metals and Technology (Zhengzhou Research Institute of Mechanical Engineering)[SKLABFMT-2015-03]
WOS Research AreaEngineering ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectEngineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:000404860500004
PublisherEMERALD GROUP PUBLISHING LTD
Citation statistics
Cited Times:4[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/124510
Collection中国科学院金属研究所
Corresponding AuthorZhang, Liang
Affiliation1.Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou, Peoples R China
2.Chinese Acad Sci, Inst Met Res, Shenyang, Peoples R China
3.Zhengzhou Res Inst Mech Engn, State Key Lab Adv Brazing Filler Met & Technol, Zhengzhou, Peoples R China
Recommended Citation
GB/T 7714
Zhang, Liang,Liu, Zhi-quan,Yang, Fan,et al. Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC[J]. SOLDERING & SURFACE MOUNT TECHNOLOGY,2017,29(3):151-155.
APA Zhang, Liang,Liu, Zhi-quan,Yang, Fan,&Zhong, Su-juan.(2017).Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC.SOLDERING & SURFACE MOUNT TECHNOLOGY,29(3),151-155.
MLA Zhang, Liang,et al."Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC".SOLDERING & SURFACE MOUNT TECHNOLOGY 29.3(2017):151-155.
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