| Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC | |
| Zhang, Liang1,2; Liu, Zhi-quan2; Yang, Fan1; Zhong, Su-juan3 | |
| Corresponding Author | Zhang, Liang(zhangliang@jsnu.edu.cn) |
| 2017 | |
| Source Publication | SOLDERING & SURFACE MOUNT TECHNOLOGY
 |
| ISSN | 0954-0911 |
| Volume | 29Issue:3Pages:151-155 |
| Abstract | Purpose - This paper aims to investigate Cu/SnAgCu/Cu transient liquid phase (TLP) bonding with different thicknesses for three-dimensional (3D) integrated circuit (IC). Design/methodology/approach - This paper includes experiments and finite element simulation. Findings - The growth rate of the intermetallic compound layer during TLP soldering was calculated to be 0.6 mu m/s, and the small scallop-type morphology Cu6Sn5 grains can be observed. With the decrease in thickness in solder joint, the thickness of intermetallic compounds represents the same size and morphology, but the size of eutectic particles (Ag3Sn, Cu6Sn5) in the matrix microstructure decrease obviously. It is found that with the increase in thickness, the tensile strength drops obviously. Based on finite element simulation, the smaller value of von Mises demonstrated that the more reliability of lead-free solder joints in 3D IC. Originality/value -The Cu/SnAgCu/Cu TLP bonding with different thicknesses for 3D IC was investigated. |
| Keyword | Alloys Sn-Ag-Cu Finite element modeling (FEM) Reliability |
| Funding Organization | Natural Science Foundation of China ; Qing Lan Project ; China Postdoctoral Science Foundation ; State Foundation of Laboratory of Advanced Brazing Filler Metals and Technology (Zhengzhou Research Institute of Mechanical Engineering) |
| DOI | 10.1108/SSMT-07-2016-0015 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | Natural Science Foundation of China[51475220] ; Qing Lan Project ; China Postdoctoral Science Foundation[2016M591464] ; State Foundation of Laboratory of Advanced Brazing Filler Metals and Technology (Zhengzhou Research Institute of Mechanical Engineering)[SKLABFMT-2015-03] |
| WOS Research Area | Engineering ; Materials Science ; Metallurgy & Metallurgical Engineering |
| WOS Subject | Engineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
| WOS ID | WOS:000404860500004 |
| Publisher | EMERALD GROUP PUBLISHING LTD |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/124510 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Zhang, Liang |
| Affiliation | 1.Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang, Peoples R China 3.Zhengzhou Res Inst Mech Engn, State Key Lab Adv Brazing Filler Met & Technol, Zhengzhou, Peoples R China |
| Recommended Citation GB/T 7714 | Zhang, Liang,Liu, Zhi-quan,Yang, Fan,et al. Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC[J]. SOLDERING & SURFACE MOUNT TECHNOLOGY,2017,29(3):151-155. |
| APA | Zhang, Liang,Liu, Zhi-quan,Yang, Fan,&Zhong, Su-juan.(2017).Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC.SOLDERING & SURFACE MOUNT TECHNOLOGY,29(3),151-155. |
| MLA | Zhang, Liang,et al."Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC".SOLDERING & SURFACE MOUNT TECHNOLOGY 29.3(2017):151-155. |
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