| Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC | |
| Zhang, Liang1,2; Liu, Zhi-quan2; Yang, Fan1; Zhong, Su-juan3 | |
| 通讯作者 | Zhang, Liang(zhangliang@jsnu.edu.cn) |
| 2017 | |
| 发表期刊 | SOLDERING & SURFACE MOUNT TECHNOLOGY
 |
| ISSN | 0954-0911 |
| 卷号 | 29期号:3页码:151-155 |
| 摘要 | Purpose - This paper aims to investigate Cu/SnAgCu/Cu transient liquid phase (TLP) bonding with different thicknesses for three-dimensional (3D) integrated circuit (IC). Design/methodology/approach - This paper includes experiments and finite element simulation. Findings - The growth rate of the intermetallic compound layer during TLP soldering was calculated to be 0.6 mu m/s, and the small scallop-type morphology Cu6Sn5 grains can be observed. With the decrease in thickness in solder joint, the thickness of intermetallic compounds represents the same size and morphology, but the size of eutectic particles (Ag3Sn, Cu6Sn5) in the matrix microstructure decrease obviously. It is found that with the increase in thickness, the tensile strength drops obviously. Based on finite element simulation, the smaller value of von Mises demonstrated that the more reliability of lead-free solder joints in 3D IC. Originality/value -The Cu/SnAgCu/Cu TLP bonding with different thicknesses for 3D IC was investigated. |
| 关键词 | Alloys Sn-Ag-Cu Finite element modeling (FEM) Reliability |
| 资助者 | Natural Science Foundation of China ; Qing Lan Project ; China Postdoctoral Science Foundation ; State Foundation of Laboratory of Advanced Brazing Filler Metals and Technology (Zhengzhou Research Institute of Mechanical Engineering) |
| DOI | 10.1108/SSMT-07-2016-0015 |
| 收录类别 | SCI |
| 语种 | 英语 |
| 资助项目 | Natural Science Foundation of China[51475220] ; Qing Lan Project ; China Postdoctoral Science Foundation[2016M591464] ; State Foundation of Laboratory of Advanced Brazing Filler Metals and Technology (Zhengzhou Research Institute of Mechanical Engineering)[SKLABFMT-2015-03] |
| WOS研究方向 | Engineering ; Materials Science ; Metallurgy & Metallurgical Engineering |
| WOS类目 | Engineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
| WOS记录号 | WOS:000404860500004 |
| 出版者 | EMERALD GROUP PUBLISHING LTD |
| 引用统计 | |
| 文献类型 | 期刊论文 |
| 条目标识符 | http://ir.imr.ac.cn/handle/321006/124510 |
| 专题 | 中国科学院金属研究所 |
| 通讯作者 | Zhang, Liang |
| 作者单位 | 1.Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang, Peoples R China 3.Zhengzhou Res Inst Mech Engn, State Key Lab Adv Brazing Filler Met & Technol, Zhengzhou, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zhang, Liang,Liu, Zhi-quan,Yang, Fan,et al. Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC[J]. SOLDERING & SURFACE MOUNT TECHNOLOGY,2017,29(3):151-155. |
| APA | Zhang, Liang,Liu, Zhi-quan,Yang, Fan,&Zhong, Su-juan.(2017).Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC.SOLDERING & SURFACE MOUNT TECHNOLOGY,29(3),151-155. |
| MLA | Zhang, Liang,et al."Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC".SOLDERING & SURFACE MOUNT TECHNOLOGY 29.3(2017):151-155. |
| 条目包含的文件 | 条目无相关文件。 | |||||
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