IMR OpenIR
Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect
Zhu, Qingsheng1; Zhang, Xian1; Li, Sujie1; Liu, Chunzhong2; Li, Cai-Fu3
Corresponding AuthorZhu, Qingsheng(qszhu@mir.ac.cn) ; Zhang, Xian(xzhang14s@imr.ac.cn) ; Liu, Chunzhong(czliu@sau.edu.cn)
2018-11-09
Source PublicationJOURNAL OF THE ELECTROCHEMICAL SOCIETY
ISSN0013-4651
Volume166Issue:1Pages:D3097-D3099
AbstractLarge-scale Cu nanotwins were electrodeposited in void-free filling within blind microvia using single gelatin as additive in electrolyte. The void-free filling effect was might be caused by a gradient suppressing effect of gelatin along the microvia depth. The gradient distribution of gelatin was resulted from the strong dependence of adsorption on convection force. The adsorbed gelatin might greatly increase the surface tension on the depositing atom plane and then dragged a layer of adatom to a misarranged sites in the lattice, leading to the twinning nucleation. (C) The Author(s) 2018. Published by ECS.
Funding OrganizationNational Natural Science Foundation of China (NSFC) ; Science and Technology Program of Shenyang
DOI10.1149/2.0131901jes
Indexed BySCI
Language英语
Funding ProjectNational Natural Science Foundation of China (NSFC)[51471180] ; Science and Technology Program of Shenyang[F16-205-1-18]
WOS Research AreaElectrochemistry ; Materials Science
WOS SubjectElectrochemistry ; Materials Science, Coatings & Films
WOS IDWOS:000449759700001
PublisherELECTROCHEMICAL SOC INC
Citation statistics
Cited Times:2[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/130343
Collection中国科学院金属研究所
Corresponding AuthorZhu, Qingsheng; Zhang, Xian; Liu, Chunzhong
Affiliation1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China
2.Shenyang Aerosp Univ, Coll Mat Sci & Engn, Shenyang 110136, Liaoning, Peoples R China
3.Osaka Univ Ibaraki, Inst Sci & Ind Res, Osaka, Japan
Recommended Citation
GB/T 7714
Zhu, Qingsheng,Zhang, Xian,Li, Sujie,et al. Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY,2018,166(1):D3097-D3099.
APA Zhu, Qingsheng,Zhang, Xian,Li, Sujie,Liu, Chunzhong,&Li, Cai-Fu.(2018).Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect.JOURNAL OF THE ELECTROCHEMICAL SOCIETY,166(1),D3097-D3099.
MLA Zhu, Qingsheng,et al."Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect".JOURNAL OF THE ELECTROCHEMICAL SOCIETY 166.1(2018):D3097-D3099.
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Zhu, Qingsheng]'s Articles
[Zhang, Xian]'s Articles
[Li, Sujie]'s Articles
Baidu academic
Similar articles in Baidu academic
[Zhu, Qingsheng]'s Articles
[Zhang, Xian]'s Articles
[Li, Sujie]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Zhu, Qingsheng]'s Articles
[Zhang, Xian]'s Articles
[Li, Sujie]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.