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Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density 期刊论文
MICROELECTRONICS RELIABILITY, 2023, 卷号: 146, 页码: 8
作者:  Zhu, Qing-Sheng;  Ding, Zi-Feng;  Wei, Xiang-Fu;  Guo, Jing-dong;  Wang, Xiao-Jing
收藏  |  浏览/下载：9/0  |  提交时间：2024/01/07
Copper pillar bump  Cu electroplating  Leveler  Interfacial voids  Chip packaging  
Obtaining ultra-high throwing power in Cu electroplating of flexible printed circuit by fast consumption of a suppressor 期刊论文
JOURNAL OF SOLID STATE ELECTROCHEMISTRY, 2021, 页码: 11
作者:  Wei, Xiang-Fu;  Zhu, Qing-Sheng;  Guo, Jing-Dong;  Shang, Jian-Ku
收藏  |  浏览/下载：112/0  |  提交时间：2021/11/22
Copper electroplating  Throwing power (TP)  Flexible printed circuit (FPC)  Suppressor  
Flexible silver nanowire transparent conductive films prepared by an electrostatic adsorption self-assembly process 期刊论文
JOURNAL OF MATERIALS SCIENCE, 2019, 卷号: 54, 期号: 7, 页码: 5802-5812
作者:  Zheng, Boda;  Zhu, Qingsheng;  Zhao, Yang
收藏  |  浏览/下载：101/0  |  提交时间：2021/02/02
Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 卷号: 166, 期号: 1, 页码: D3097-D3099
作者:  Zhu, Qingsheng;  Zhang, Xian;  Li, Sujie;  Liu, Chunzhong;  Li, Cai-Fu
收藏  |  浏览/下载：115/0  |  提交时间：2021/02/02
Effect of Reverse Pulse on Additives Adsorption and Copper Filling for Through Silicon Via 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 卷号: 166, 期号: 1, 页码: D3006-D3012
作者:  Zhu, Q. S.;  Zhang, X.;  Liu, C. Z.;  Liu, H. Y.
收藏  |  浏览/下载：135/0  |  提交时间：2021/02/02