IMR OpenIR

Browse/Search Results:  1-4 of 4 Help

Selected(0)Clear Items/Page:    Sort:
Obtaining ultra-high throwing power in Cu electroplating of flexible printed circuit by fast consumption of a suppressor 期刊论文
JOURNAL OF SOLID STATE ELECTROCHEMISTRY, 2021, 页码: 11
Authors:  Wei, Xiang-Fu;  Zhu, Qing-Sheng;  Guo, Jing-Dong;  Shang, Jian-Ku
Favorite  |  View/Download:51/0  |  Submit date:2021/11/22
Copper electroplating  Throwing power (TP)  Flexible printed circuit (FPC)  Suppressor  
Flexible silver nanowire transparent conductive films prepared by an electrostatic adsorption self-assembly process 期刊论文
JOURNAL OF MATERIALS SCIENCE, 2019, 卷号: 54, 期号: 7, 页码: 5802-5812
Authors:  Zheng, Boda;  Zhu, Qingsheng;  Zhao, Yang
Favorite  |  View/Download:45/0  |  Submit date:2021/02/02
Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 卷号: 166, 期号: 1, 页码: D3097-D3099
Authors:  Zhu, Qingsheng;  Zhang, Xian;  Li, Sujie;  Liu, Chunzhong;  Li, Cai-Fu
Favorite  |  View/Download:51/0  |  Submit date:2021/02/02
Effect of Reverse Pulse on Additives Adsorption and Copper Filling for Through Silicon Via 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 卷号: 166, 期号: 1, 页码: D3006-D3012
Authors:  Zhu, Q. S.;  Zhang, X.;  Liu, C. Z.;  Liu, H. Y.
Favorite  |  View/Download:57/0  |  Submit date:2021/02/02