| Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding | |
| Yang, Haokun1,2; Cao, Ke1; Zhao, XiaoTian4; Liu, Wei4; Lu, Jian1,2,3; Lu, Yang1,2,3 | |
| Corresponding Author | Lu, Jian(jianlu@cityu.edu.hk) ; Lu, Yang(yanglu@cityu.edu.hk) |
| 2019 | |
| Source Publication | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| ISSN | 0957-4522 |
| Volume | 30Issue:1Pages:862-866 |
| Abstract | Au-Al intermetallic compounds (IMCs) were conventionally regarded as damage sources within wire bonding interfaces. Among the Au-Al IMCs system, Au2Al and AuAl2 IMCs were commonly observed after long-term service. Here, the intrinsic mechanical properties of Au2Al and AuAl2 IMCs were investigated by in-situ bending tests. The results clearly revealed that the transition from brittle to ductile facture behavior was determined by the atomic ratio of Au and Al elements, while Al-rich Au-Al IMC exhibits higher bending strength than that of Au-rich Au-Al IMC. The Al-rich Au-Al IMC such as AuAl2 indeed showed brittle fracture behavior, in which cracks propagated through the grain boundaries. In contrast, the Au-rich Au-Al IMC such as Au2Al appeared to be quite ductile and crack resistant, and its plastic deformation was undertaken by slip bands. This work suggested that not all Au-Al IMCs cause brittleness and lead to damages, only Al-rich IMCs should be avoided at wire bonding interfaces. |
| Funding Organization | National Key R&D Program of China ; Shenzhen Virtual University Park ; Innovation and Technology Commission via the Hong Kong Branch of National Precious Metals Material Engineering Research Center ; Research Grants Council of the Hong Kong Special Administrative Region, China ; Province-Institute/Province-College Cooperation Project ; SZSTI ; Hong Kong Branch of National Precious Metals Material Engineering Research Centre |
| DOI | 10.1007/s10854-018-0357-6 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | National Key R&D Program of China[2017YFA0204403] ; Shenzhen Virtual University Park[R-IND1710] ; Innovation and Technology Commission via the Hong Kong Branch of National Precious Metals Material Engineering Research Center ; Research Grants Council of the Hong Kong Special Administrative Region, China[CityU 11209914] ; Research Grants Council of the Hong Kong Special Administrative Region, China[11247516] ; Province-Institute/Province-College Cooperation Project[2017IB016] ; SZSTI[JSGG20141020103826038] ; Hong Kong Branch of National Precious Metals Material Engineering Research Centre |
| WOS Research Area | Engineering ; Materials Science ; Physics |
| WOS Subject | Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter |
| WOS ID | WOS:000456048800092 |
| Publisher | SPRINGER |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/131460 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Lu, Jian; Lu, Yang |
| Affiliation | 1.City Univ Hong Kong, Hong Kong Branch, Natl Precious Met Mat Engn Res Ctr, 83 Tat Chee Ave, Hong Kong, Peoples R China 2.City Univ Hong Kong, Dept Mech Engn, 83 Tat Chee Ave, Hong Kong, Peoples R China 3.City Univ Hong Kong, Ctr Adv Struct Mat, Shenzhen Res Inst, 8 Yuexing 1st Rd, Shenzhen, Peoples R China 4.Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China |
| Recommended Citation GB/T 7714 | Yang, Haokun,Cao, Ke,Zhao, XiaoTian,et al. Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(1):862-866. |
| APA | Yang, Haokun,Cao, Ke,Zhao, XiaoTian,Liu, Wei,Lu, Jian,&Lu, Yang.(2019).Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,30(1),862-866. |
| MLA | Yang, Haokun,et al."Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 30.1(2019):862-866. |
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