| The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy | |
| Ong, Chun Yee Aaron1; Blackwood, Daniel John1; Li, Yi2 | |
| Corresponding Author | Ong, Chun Yee Aaron(mseocya@nus.edu.sg) |
| 2019-01-15 | |
| Source Publication | SURFACE & COATINGS TECHNOLOGY
 |
| ISSN | 0257-8972 |
| Volume | 357Pages:23-27 |
| Abstract | Nanocrystalline and amorphous nickel-tungsten alloy with relatively high tungsten contents of up to 34 at.% were produced by electrodeposition. The Hall-Petch relationship and breakdown was studied in this alloy, with grain sizes ranging from 25 nm to fully amorphous. In this higher tungsten content alloy, evidence of solid-solution strengthening was found, which was previously absent in alloys with < 13 at.% tungsten. A Hall-Petch trend with a critical grain size of 5 nm was observed, in line with expectations. |
| Keyword | Nickel-tungsten Hall-Petch effect Electrodeposition Nanocrystalline metal Nickel alloys |
| Funding Organization | National Natural Science Foundation of China |
| DOI | 10.1016/j.surfcoat.2018.09.086 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | National Natural Science Foundation of China[51471165] |
| WOS Research Area | Materials Science ; Physics |
| WOS Subject | Materials Science, Coatings & Films ; Physics, Applied |
| WOS ID | WOS:000455691100003 |
| Publisher | ELSEVIER SCIENCE SA |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/131466 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Ong, Chun Yee Aaron |
| Affiliation | 1.Natl Univ Singapore, Dept Mat Sci & Engn, Blk EA 03-09,9 Engn Dr 1, Singapore 117575, Singapore 2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Liaoning, Peoples R China |
| Recommended Citation GB/T 7714 | Ong, Chun Yee Aaron,Blackwood, Daniel John,Li, Yi. The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy[J]. SURFACE & COATINGS TECHNOLOGY,2019,357:23-27. |
| APA | Ong, Chun Yee Aaron,Blackwood, Daniel John,&Li, Yi.(2019).The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy.SURFACE & COATINGS TECHNOLOGY,357,23-27. |
| MLA | Ong, Chun Yee Aaron,et al."The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy".SURFACE & COATINGS TECHNOLOGY 357(2019):23-27. |
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