Highly solderability of FeP film in contact with SnAgCu solder

doi:10.1016/j.jallcom.2019.152900

IMR OpenIR

	Highly solderability of FeP film in contact with SnAgCu solder
	Zhou, Haifei 1; Guo, Jingdong 2; Shang, Jianku 3; Song, Xiaoning 1
通讯作者	Guo, Jingdong(jdguo@imr.ac.cn) ; Shang, Jianku(jkshang@illinois.edu)
	2020-03-25
发表期刊	JOURNAL OF ALLOYS AND COMPOUNDS
ISSN	0925-8388
卷号	818 页码:6
摘要	New under bump metallization (UBM) is required for future microelectronics to minimize reliability concerns with solder interconnects. In this study, electroless FeP film was prepared as UBM. Solderability of electroless NiP, electrodeposite Fe and electroless FeP films with eutectic SnAgCu solder was investigated by static wetting tests and wetting balance measurements. Results revealed that the solderability of NiP film has almost no change with thermal aged for the film in air atmosphere increasing. The contact angles for FeP and Fe films with SnAgCu solder increased and the maximum wetting force decreased with heating time increasing from 0 h, 48 h, 89 h-160 h at 180 degrees C. But the solderability of FeP film was found to be better than those of NiP and Fe whether the films in base or thermal aged at 180 degrees C for 89 h. Even after thermal aged in air atmosphere at 180 degrees C for 160 h, the FeP also performed the smallest contace angle compared with the NiP and the Fe. Oxide layer on the surface of FeP was much easier to be removed by rosin mildly activated flux during reflow process because loose structure. It was proved to be the key for the highly solderability of electroless FeP. (C) 2019 Elsevier B.V. All rights reserved.
关键词	Solderability Electroless FeP SnAgCu Oxidation
资助者	State Grid Scientific and Technological Research Program of China
DOI	10.1016/j.jallcom.2019.152900
收录类别	SCI
语种	英语
资助项目	State Grid Scientific and Technological Research Program of China[5211DS17001X]
WOS研究方向	Chemistry ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Chemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000506166900072
出版者	ELSEVIER SCIENCE SA
引用统计	被引频次：4[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/136330
专题	中国科学院金属研究所
通讯作者	Guo, Jingdong; Shang, Jianku
作者单位	1.Zhejiang Elect Power Corp Res Inst, Hangzhou 310014, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 3.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA
推荐引用方式 GB/T 7714	Zhou, Haifei,Guo, Jingdong,Shang, Jianku,et al. Highly solderability of FeP film in contact with SnAgCu solder[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2020,818:6.
APA	Zhou, Haifei,Guo, Jingdong,Shang, Jianku,&Song, Xiaoning.(2020).Highly solderability of FeP film in contact with SnAgCu solder.JOURNAL OF ALLOYS AND COMPOUNDS,818,6.
MLA	Zhou, Haifei,et al."Highly solderability of FeP film in contact with SnAgCu solder".JOURNAL OF ALLOYS AND COMPOUNDS 818(2020):6.