IMR OpenIR
Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly
Jiang Lin1,2; Zhang Liang1,3; Liu Zhiquan1,2,4
Corresponding AuthorLiu Zhiquan(zqliu@siat.ac.cn)
2020-10-11
Source PublicationACTA METALLURGICA SINICA
ISSN0412-1961
Volume56Issue:10Pages:1433-1440
AbstractSputtering has been widely used to prepare thin film due to its good cohesion with substrate, high purity, compactness, repeatability and large area manufacture. Target is a key consumable material during production of thin film by sputtering. Generally, targets are mostly rare and high purity metal, so the cost of target is very high. In order to reduce the cost of target, to improve its stiffness, and to enhance the electrical and thermal conductivity, target is usually connected with backplane to form the target assembly. The main connection method is diffusion welding, which is used in the industrial production. However, the target and the backplane are usually two different materials with different physical properties such as coefficient of thermal expansion (CTE) and thermal conductivity. During the welding or soldering process of target, the mismatch of physical properties will lead to residual stress in target, which has a direct influence on the thickness and microstructure uniformity of the films. Hence, it is very meaningful to investigate the residual stress in target and to study its influencing factor. Based on the Co/ Al/Cu sandwich structure of backplane diffusion welding, the effects of Al interlayer and Ni(V) layer on welding residual stress were studied by finite element method. It was found that the application of the Al interlayer not only can make diffusion welding process easier and lower the diffusion welding temperature, but also can reduce the maximum residual stress from 142 MPa to 126 MPa. Furthermore, the location of the maximum residual stress also changes from the outer edge of the interface between target and backplane to the position near the symmetrical axis of target and Co/Al interface. Furthermore, there is an optimal thickness for Al interlayer (7 mm). Although the existence of Ni(V) layer can inhibit the generation of brittle intermetallic compounds at the interface of Co/Al and Cu/Al, it also increases the residual stress. Moreover, we find that the increase of residual stress with Ni(V) layer at only Co/Al interface, is smaller than that of adding Ni(V) layer at both Co/Al and Cu/Al interfaces.
Keyworddiffusion welding Al interlayer Ni(V) transition layer welding residual stress Co target finite element simulation
Funding OrganizationNational Key Research and Development Program of China
DOI10.11900/0412.1961.2020.00060
Indexed BySCI
Language英语
Funding ProjectNational Key Research and Development Program of China[2017YFB0305501]
WOS Research AreaMetallurgy & Metallurgical Engineering
WOS SubjectMetallurgy & Metallurgical Engineering
WOS IDWOS:000571986900013
PublisherSCIENCE PRESS
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/140584
Collection中国科学院金属研究所
Corresponding AuthorLiu Zhiquan
Affiliation1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China
2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China
3.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China
4.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen Inst Adv Elect Mat, Shenzhen 518055, Peoples R China
Recommended Citation
GB/T 7714
Jiang Lin,Zhang Liang,Liu Zhiquan. Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly[J]. ACTA METALLURGICA SINICA,2020,56(10):1433-1440.
APA Jiang Lin,Zhang Liang,&Liu Zhiquan.(2020).Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly.ACTA METALLURGICA SINICA,56(10),1433-1440.
MLA Jiang Lin,et al."Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly".ACTA METALLURGICA SINICA 56.10(2020):1433-1440.
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Jiang Lin]'s Articles
[Zhang Liang]'s Articles
[Liu Zhiquan]'s Articles
Baidu academic
Similar articles in Baidu academic
[Jiang Lin]'s Articles
[Zhang Liang]'s Articles
[Liu Zhiquan]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Jiang Lin]'s Articles
[Zhang Liang]'s Articles
[Liu Zhiquan]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.