Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly

doi:10.11900/0412.1961.2020.00060

IMR OpenIR

	Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly
	Jiang Lin 1,2; Zhang Liang 1,3; Liu Zhiquan 1,2,4
通讯作者	Liu Zhiquan(zqliu@siat.ac.cn)
	2020-10-11
发表期刊	ACTA METALLURGICA SINICA
ISSN	0412-1961
卷号	56 期号:10 页码:1433-1440
摘要	Sputtering has been widely used to prepare thin film due to its good cohesion with substrate, high purity, compactness, repeatability and large area manufacture. Target is a key consumable material during production of thin film by sputtering. Generally, targets are mostly rare and high purity metal, so the cost of target is very high. In order to reduce the cost of target, to improve its stiffness, and to enhance the electrical and thermal conductivity, target is usually connected with backplane to form the target assembly. The main connection method is diffusion welding, which is used in the industrial production. However, the target and the backplane are usually two different materials with different physical properties such as coefficient of thermal expansion (CTE) and thermal conductivity. During the welding or soldering process of target, the mismatch of physical properties will lead to residual stress in target, which has a direct influence on the thickness and microstructure uniformity of the films. Hence, it is very meaningful to investigate the residual stress in target and to study its influencing factor. Based on the Co/ Al/Cu sandwich structure of backplane diffusion welding, the effects of Al interlayer and Ni(V) layer on welding residual stress were studied by finite element method. It was found that the application of the Al interlayer not only can make diffusion welding process easier and lower the diffusion welding temperature, but also can reduce the maximum residual stress from 142 MPa to 126 MPa. Furthermore, the location of the maximum residual stress also changes from the outer edge of the interface between target and backplane to the position near the symmetrical axis of target and Co/Al interface. Furthermore, there is an optimal thickness for Al interlayer (7 mm). Although the existence of Ni(V) layer can inhibit the generation of brittle intermetallic compounds at the interface of Co/Al and Cu/Al, it also increases the residual stress. Moreover, we find that the increase of residual stress with Ni(V) layer at only Co/Al interface, is smaller than that of adding Ni(V) layer at both Co/Al and Cu/Al interfaces.
关键词	diffusion welding Al interlayer Ni(V) transition layer welding residual stress Co target finite element simulation
资助者	National Key Research and Development Program of China
DOI	10.11900/0412.1961.2020.00060
收录类别	SCI
语种	英语
资助项目	National Key Research and Development Program of China[2017YFB0305501]
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000571986900013
出版者	SCIENCE PRESS
引用统计	被引频次：1[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/140584
专题	中国科学院金属研究所
通讯作者	Liu Zhiquan
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 3.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China 4.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen Inst Adv Elect Mat, Shenzhen 518055, Peoples R China
推荐引用方式 GB/T 7714	Jiang Lin,Zhang Liang,Liu Zhiquan. Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly[J]. ACTA METALLURGICA SINICA,2020,56(10):1433-1440.
APA	Jiang Lin,Zhang Liang,&Liu Zhiquan.(2020).Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly.ACTA METALLURGICA SINICA,56(10),1433-1440.
MLA	Jiang Lin,et al."Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly".ACTA METALLURGICA SINICA 56.10(2020):1433-1440.