Dalian

IMR OpenIR

	Dalian
其他题名	Dalian
	Wei WANG; Zhongguang WANG; Aiping XIAN; Jianku SHANG
	2007
发表期刊	Journal of Materials Science & Technology
ISSN	1005-0302
卷号	23 期号:1 页码:85-91
摘要	Two kinds of CBGA (ceramic ball grid array) assemblies were made by reflow soldering process using two different Pb-free solders. Microstructural evolution and cracks induced by thermal cycling in CBGA assemblies were examined by scanning electron microscopy (SEM) and finite element method (FEM). Before thermal cycling, intermetallic compounds (IMCs) Cu6Sn5 and Ag3Sn were observed at the solder interface between Cu and Ag metallizations, respectively. After thermal cycling, another IMC Cu3Sn was observed near the Cu pad in both two assemblies and the layers of Cu6Sn5 and Ag3Sn became thicker. As a result of thermal cycling,cyclic stress and strain were accumulated in the solder joint leading to fatigue cracking. Both experiments and FEM revealed that cracks preferred to initiate at the corner of each solder joint. Multi-modes of the crack propagation were found in the two assemblies. Based on Coffin-Manson equation, the thermal fatigue life was calculated and the predicted life showed good agreement with the experimental results.
其他摘要	Two kinds of CBGA (ceramic ball grid array) assemblies were made by reflow soldering process using two different Pb-free solders. Microstructural evolution and cracks induced by thermal cycling in CBGA assemblies were examined by scanning electron microscopy (SEM) and finite element method (FEM). Before thermal cycling, intermetallic compounds (IMCs) Cu6Sn5 and Ag3Sn were observed at the solder interface between Cu and Ag metallizations, respectively. After thermal cycling, another IMC Cu3Sn was observed near the Cu pad in both two assemblies and the layers of Cu6Sn5 and Ag3Sn became thicker. As a result of thermal cycling,cyclic stress and strain were accumulated in the solder joint leading to fatigue cracking. Both experiments and FEM revealed that cracks preferred to initiate at the corner of each solder joint. Multi-modes of the crack propagation were found in the two assemblies. Based on Coffin-Manson equation, the thermal fatigue life was calculated and the predicted life showed good agreement with the experimental results.
关键词	CBGA Thermal cycling FEM Assembly Cracking
收录类别	CSCD
语种	英语
CSCD记录号	CSCD:3192610
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/143228
专题	中国科学院金属研究所
作者单位	中国科学院金属研究所
推荐引用方式 GB/T 7714	Wei WANG,Zhongguang WANG,Aiping XIAN,et al. Dalian[J]. Journal of Materials Science & Technology,2007,23(1):85-91.
APA	Wei WANG,Zhongguang WANG,Aiping XIAN,&Jianku SHANG.(2007).Dalian.Journal of Materials Science & Technology,23(1),85-91.
MLA	Wei WANG,et al."Dalian".Journal of Materials Science & Technology 23.1(2007):85-91.