Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

IMR OpenIR

	Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect
其他题名	Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect
	Kang T Y 1; Xiu Y Y 2; Hui L 2; Wang J J 2; Tong W P 1; Liu C Z 2
	2011
发表期刊	JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
ISSN	1005-0302
卷号	27 期号:8 页码:741-745
摘要	The intermetallic compound (IMC) growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210 degrees C for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they were aged at the same temperature. And the activation energy Q(a) for total IMC in Sn10 wt%Bi/Cu joint was lower than that for pure Sn/Cu interconnect. The IMC growth process was discussed. The IMC Cu6Sn5 was enhanced in compensation of reduced IMC Cu3Sn growth. The work reveals that Bi element containing in lead free solder alloys with 10 wt% can enhance IMC growth in lead free solder/Cu joint during service.
其他摘要	The intermetallic compound (IMC) growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210°C for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they were aged at the same temperature. And the activation energy Qa for total IMC in Sn10 wt%Bi/Cu joint was lower than that for pure Sn/Cu interconnect. The IMC growth process was discussed. The IMC Cu6Sn5 was enhanced in compensation of reduced IMC Cu3Sn growth. The work reveals that Bi element containing in lead free solder alloys with 10 wt% can enhance IMC growth in lead free solder/Cu joint during service.
关键词	SN-AG CU SUBSTRATE INTERFACIAL REACTIONS MICROSTRUCTURE COPPER BI TEMPERATURE STRENGTH ALLOYS JOINTS Solder Interfacial reaction Intermetallics Kinetics
收录类别	CSCD
语种	英语
资助项目	[National Natural Science Foundation of China] ; [111 Project] ; [Foundation of National Excellent Doctoral Dissertation of China] ; [Program for New Century Excellent Talents in University] ; [Fundamental Research Funds for the Central Universities]
CSCD记录号	CSCD:4410852
引用统计	被引频次：2[CSCD] [CSCD记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/157757
专题	中国科学院金属研究所
作者单位	1.上海市地震局 2.中国科学院金属研究所
推荐引用方式 GB/T 7714	Kang T Y,Xiu Y Y,Hui L,et al. Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2011,27(8):741-745.
APA	Kang T Y,Xiu Y Y,Hui L,Wang J J,Tong W P,&Liu C Z.(2011).Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,27(8),741-745.
MLA	Kang T Y,et al."Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 27.8(2011):741-745.