| High-temperature aging time-induced composition and thickness evolution in the native oxides film on Sn solder substrate | |
| Qiao, Chuang1,2; Sun, Xu2,3; Wang, Youzhi2,4; Hao, Long2,4; Liu, Xiahe1; An, Xizhong1 | |
| Corresponding Author | Hao, Long(chinahaolong@126.com) |
| 2021-09-02 | |
| Source Publication | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| ISSN | 0957-4522 |
| Pages | 20 |
| Abstract | The presence of a native oxides film on Pb-free Sn solder joint surface is inevitable and its structure could be influenced by high-temperature aging due to heat release of electronic device itself during application. In this work, the effect of high-temperature aging time at 90 degrees C on composition and thickness evolution of a native oxides film, formed on pure Sn solder substrate after 24 h exposure to 90% RH atmosphere at 25 degrees C, has been characterized by AR-XPS and EIS. Results indicate that the outer layer of the as-obtained native oxide film consists of more Sn(OH)(4) and less SnO2, and the inner layer consists of more SnO and less Sn(OH)(2). The aging process initially accelerates both the dehydration/oxidation of hydroxides/stannous oxides in the film and the fresh Sn substrate to form SnO2, contributing to an increasing thickness and improved corrosion resistance of the film. However, an extended aging time deteriorates the structure of the film with more cracks and lowered corrosion resistance. Moreover, comparison finds that, without any assumption on models of resistivity distribution through the oxides film, the film thickness determination by Cole-Cole representation of the EIS results fits well with that by AR-XPS analyses. |
| Funding Organization | CAS Key Laboratory of Nuclear Materials and Safety Assessment, Institute of Metal Research Chinese Academy of Sciences |
| DOI | 10.1007/s10854-021-06887-2 |
| Indexed By | SCI |
| Language | 英语 |
| Funding Project | CAS Key Laboratory of Nuclear Materials and Safety Assessment, Institute of Metal Research Chinese Academy of Sciences |
| WOS Research Area | Engineering ; Materials Science ; Physics |
| WOS Subject | Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter |
| WOS ID | WOS:000692095300003 |
| Publisher | SPRINGER |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/166886 |
| Collection | 中国科学院金属研究所 |
| Corresponding Author | Hao, Long |
| Affiliation | 1.Northeastern Univ, Sch Met, Key Lab Ecol Met Multimetall Mineral, Minist Educ, Shenyang 110819, Peoples R China 2.Chinese Acad Sci, Inst Met Res, CAS Key Lab Nucl Mat & Safety Assessment, Shenyang 110016, Peoples R China 3.Shenyang Ligong Univ, Coll Mat Sci & Engn, Shenyang 110159, Peoples R China 4.Univ Sci & Technol China, Sch Mat Sci & Engn, Hefei 230026, Peoples R China |
| Recommended Citation GB/T 7714 | Qiao, Chuang,Sun, Xu,Wang, Youzhi,et al. High-temperature aging time-induced composition and thickness evolution in the native oxides film on Sn solder substrate[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2021:20. |
| APA | Qiao, Chuang,Sun, Xu,Wang, Youzhi,Hao, Long,Liu, Xiahe,&An, Xizhong.(2021).High-temperature aging time-induced composition and thickness evolution in the native oxides film on Sn solder substrate.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,20. |
| MLA | Qiao, Chuang,et al."High-temperature aging time-induced composition and thickness evolution in the native oxides film on Sn solder substrate".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2021):20. |
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