Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer

IMR OpenIR

	Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer
	Zhang, Liang; Liu, Zhi-quan; Yang, Fan; Zhong, Su-juan; Zhang, L (reprint author), Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Peoples R China.; Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
	2017-04-01
发表期刊	MATERIALS
ISSN	1996-1944
卷号	10 期号:4 页码:-
摘要	Cu6Sn5 whiskers precipitated in Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer were found and investigated after reflow soldering and during aging. Ag3Sn fibers can be observed around Cu6Sn5 whiskers in the matrix microstructure, which can play an active effect on the reliability of interconnection. Different morphologies of Cu6Sn5 whiskers can be observed, and hexagonal rod structure is the main morphology of Cu6Sn5 whiskers. A hollow structure can be observed in hexagonal Cu6Sn5 whiskers, and a screw dislocation mechanism was used to represent the Cu6Sn5 growth. Based on mechanical property testing and finite element simulation, Cu6Sn5 whiskers were regarded as having a negative effect on the durability of Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer.; Cu6Sn5 whiskers precipitated in Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer were found and investigated after reflow soldering and during aging. Ag3Sn fibers can be observed around Cu6Sn5 whiskers in the matrix microstructure, which can play an active effect on the reliability of interconnection. Different morphologies of Cu6Sn5 whiskers can be observed, and hexagonal rod structure is the main morphology of Cu6Sn5 whiskers. A hollow structure can be observed in hexagonal Cu6Sn5 whiskers, and a screw dislocation mechanism was used to represent the Cu6Sn5 growth. Based on mechanical property testing and finite element simulation, Cu6Sn5 whiskers were regarded as having a negative effect on the durability of Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer.
部门归属	[zhang, liang ; yang, fan] jiangsu normal univ, sch mechatron engn, xuzhou 221116, peoples r china ; [zhang, liang ; liu, zhi-quan] chinese acad sci, inst met res, shenyang 110016, peoples r china ; [zhong, su-juan] zhengzhou res inst mech engn, state key lab adv brazing filler met & technol, zhengzhou 450001, peoples r china
关键词	Cu6sn5 Whiskers Ag3sn Fibers Mechanical Property Screw Dislocation
学科领域	Materials Science, Multidisciplinary
资助者	Natural Science Foundation of China [51475220]; Qing Lan Project; China Postdoctoral Science Foundation [2016M591464]; Six talent peaks project in Jiangsu Province [XCL-022]; State Foundation of Laboratory of Advanced Brazing Filler Metals Technology [SKLABFMT-2015-03]
收录类别	SCI
语种	英语
WOS记录号	WOS:000402843800002
引用统计	被引频次：10[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/78195
专题	中国科学院金属研究所
通讯作者	Zhang, L (reprint author), Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Peoples R China.; Zhang, L (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China.
推荐引用方式 GB/T 7714	Zhang, Liang,Liu, Zhi-quan,Yang, Fan,et al. Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer[J]. MATERIALS,2017,10(4):-.
APA	Zhang, Liang,Liu, Zhi-quan,Yang, Fan,Zhong, Su-juan,Zhang, L ,&Zhang, L .(2017).Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer.MATERIALS,10(4),-.
MLA	Zhang, Liang,et al."Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer".MATERIALS 10.4(2017):-.