Microstructure-based modeling of IMC layer thickness effect on tensile behavior of Cu/Al clad strip

doi:10.1088/2053-1591/ab6c0a

IMR OpenIR

	Microstructure-based modeling of IMC layer thickness effect on tensile behavior of Cu/Al clad strip
	Sun,Tao 1; Song,Hong-wu 2; Hua,Fu-an 1; Li,Jian-ping 1
	2020
发表期刊	Materials Research Express
卷号	7 期号:1
摘要	Abstract A microstructure-based model is proposed for quantitative estimation of tensile mechanical property of Cu/Al clad strips. In the proposed model, the fracture criterion for matrix Cu and Al, interface intermetallic compounds (IMCs) and interface between matrix and IMCs are established and incorporated. The effect of IMCs thickness and strip thickness on tensile behavior of Cu/Al strip was studied quantitatively using the proposed model. And a new dimensionless parameter w/t is also proposed to be a control index for tensile mechanical property of Cu/Al clad strips. And a critical value of w/t which is defined to be 0.025 in this study is found to be important in controlling mechanical property of Cu/Al strip with a thickness less than 0.5 mm. The potential application of the proposed model and parameter is also discussed for annealing process optimization and mechanical property control of 0.12 mm thick Cu/Al clad strips.
关键词	clad strip cold roll bonding intermetallic compound tensile property microstructure-based modeling
DOI	10.1088/2053-1591/ab6c0a
语种	英语
WOS记录号	IOP:2053-1591-7-1-ab6c0a
出版者	IOP Publishing
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/80633
专题	中国科学院金属研究所
作者单位	1.The State Key Laboratory of Rolling and Automation, Northeastern University, Shenyang 110819, People’s Republic of China 2.Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People’s Republic of China
推荐引用方式 GB/T 7714	Sun,Tao,Song,Hong-wu,Hua,Fu-an,et al. Microstructure-based modeling of IMC layer thickness effect on tensile behavior of Cu/Al clad strip[J]. Materials Research Express,2020,7(1).
APA	Sun,Tao,Song,Hong-wu,Hua,Fu-an,&Li,Jian-ping.(2020).Microstructure-based modeling of IMC layer thickness effect on tensile behavior of Cu/Al clad strip.Materials Research Express,7(1).
MLA	Sun,Tao,et al."Microstructure-based modeling of IMC layer thickness effect on tensile behavior of Cu/Al clad strip".Materials Research Express 7.1(2020).