Microscopic investigation of strain localization and fatigue damage in thin Cu films

IMR OpenIR

	Microscopic investigation of strain localization and fatigue damage in thin Cu films
	Zhang, GP ; Volkert, CA ; Schwaiger, R ; Kraft, O
通讯作者	Zhang, GP(gpzhang@imr.ac.cn)
	2005
发表期刊	PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5
ISSN	0255-5476
卷号	475-479 页码:3647-3650
摘要	Fatigue damage behaviour in micron and sub-micron thick Cu films has been investigated using focused ion beam (FIB) microscopy and transmission electron microscopy (TEM). The observations show that cyclic strain localization in the fatigued thin films is affected by the physical dimensions of the material, as evidenced by changes in the extrusion dimensions and by changes in the dislocation structures. The significant decrease in extrusion dimensions and the suppression of the development of bulk-like dislocation structures with decreasing film thickness and grain size is attributed to the strong inhibition of dislocation mobility and activity at small length scales.
关键词	thin films fatigue size effect dislocation structure length scale
收录类别	SCI
语种	英语
WOS研究方向	Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000227494704070
出版者	TRANS TECH PUBLICATIONS LTD
引用统计	被引频次：2[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/85383
专题	中国科学院金属研究所
通讯作者	Zhang, GP
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Max Planck Inst Met Res, D-70569 Stuttgart, Germany 3.Forschungszentrum Karlsruhe, Inst Mat Forsch 2, D-76021 Karlsruhe, Germany
推荐引用方式 GB/T 7714	Zhang, GP,Volkert, CA,Schwaiger, R,et al. Microscopic investigation of strain localization and fatigue damage in thin Cu films[J]. PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5,2005,475-479:3647-3650.
APA	Zhang, GP,Volkert, CA,Schwaiger, R,&Kraft, O.(2005).Microscopic investigation of strain localization and fatigue damage in thin Cu films.PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5,475-479,3647-3650.
MLA	Zhang, GP,et al."Microscopic investigation of strain localization and fatigue damage in thin Cu films".PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5 475-479(2005):3647-3650.