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Mechanical annealing of Cu-Si nanowires during high-cycle fatigue 期刊论文
Mrs Communications, 2014, 卷号: 4, 期号: 3, 页码: 83-87
Authors:  C. Ensslen;  O. Kraft;  R. Monig;  J. Xu;  G. P. Zhang;  R. Schneider
Favorite  |  View/Download：3/0  |  Submit date：2015/01/14
Nanocrystalline Copper  Plastic-deformation  Thin Copper  Nanowhiskers  Behavior  Crystals  Metals  Scale  Films  Wires  
Fatigue and thermal fatigue damage analysis of thin metal films 期刊论文
Microelectronics Reliability, 2007, 卷号: 47, 期号: 12, 页码: 2007-2013
Authors:  G. P. Zhang;  C. A. Volkert;  R. Schwaiger;  R. Monig;  O. Kraft
Favorite  |  View/Download：6/0  |  Submit date：2012/04/13
High-cycle Fatigue  Copper-films  Mechanical-properties  Behavior  Size  Deformation  Specimens  Tension  
Length-scale-controlled fatigue mechanisms in thin copper films 期刊论文
Acta Materialia, 2006, 卷号: 54, 期号: 11, 页码: 3127-3139
Authors:  G. P. Zhang;  C. A. Volkert;  R. Schwaiger;  P. Wellner;  E. Arzt;  O. Kraft
Favorite  |  View/Download：4/0  |  Submit date：2012/04/14
Fatigue  Thin Films  Length Scale  Dislocation Structure  Interfaces  Severe Plastic-deformation  Ultrafine-grained Copper  Cyclic  Deformation  Strain Amplitude  Dislocation-structures  Crack Initiation  Single-crystals  Metal-films  Behavior  Size  
Damage behavior of 200-nm thin copper films under cyclic loading 期刊论文
Journal of Materials Research, 2005, 卷号: 20, 期号: 1, 页码: 201-207
Authors:  G. P. Zhang;  C. A. Volkert;  R. Schwaiger;  E. Arzt;  O. Kraft
Favorite  |  View/Download：4/0  |  Submit date：2012/04/14
Crack Initiation  Fatigue Behavior  Single-crystals  Metal-films  Dislocation-structures  Grain-size  Deformation  Compression  Thickness  Tension  
Microscopic investigation of strain localization and fatigue damage in thin Cu films 期刊论文
PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5, 2005, 卷号: 475-479, 页码: 3647-3650
Authors:  Zhang, GP;  Volkert, CA;  Schwaiger, R;  Kraft, O
Favorite  |  View/Download：1/0  |  Submit date：2021/02/02
thin films  fatigue  size effect  dislocation structure  length scale  
Effect of film thickness and grain size on fatigue-induced dislocation structures in Cu thin films 期刊论文
Philosophical Magazine Letters, 2003, 卷号: 83, 期号: 8, 页码: 477-483
Authors:  G. P. Zhang;  R. Schwaiger;  C. A. Volkert;  O. Kraft
Favorite  |  View/Download：10/0  |  Submit date：2012/04/14
Cycle Fatigue  Copper-films  Deformation  Behavior