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Effect of intermetallics Ag3Sn on the tensile property of Sn3.8Ag0.7Cu solder alloy
Zhu Qingsheng; Zhang Li; Wang Zhongguang; Wu Shiding; Shang Jianku
Corresponding AuthorWang Zhongguang(zhgwang@imx.ac.cn)
2007
Source PublicationACTA METALLURGICA SINICA
ISSN0412-1961
Volume43Issue:1Pages:41-46
AbstractSn3.8Ag0.7Cu alloys containing Ag3Sn intermetallic compound (IMC) with different morphologies, sizes and distributions were prepared by controlling cooling rate during solidification and equal channel angle pressing process (ECAP). The relation between mechanical property of the alloys and IMC phase was investigated. The tensile stress-strain curves of the alloys with different, i-nicrostructures were compared and the deformed microstructures were observed by SEM and TEM. While the large needle-like Ag3Sn was found to provide fiber-strengthening effect to the alloy, its brittle fracture promoted void nucleation, resulting in a deterioration of tensile elongation. The fine particles of Ag3Sn produced by ECAP enhanced dispersion strengthening by blocking the dislocation motion. The particles on the boundaries of fine equiaxed Sn grains inhibited the boundary sliding, leading to improvement of the tensile strength.
KeywordPb-free solder Sn3.8Ag0.7Cu alloy intermetallics equal channel angular pressing mechanical property
Indexed BySCI
Language英语
WOS Research AreaMetallurgy & Metallurgical Engineering
WOS SubjectMetallurgy & Metallurgical Engineering
WOS IDWOS:000244315000008
PublisherSCIENCE CHINA PRESS
Citation statistics
Cited Times:9[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/92451
Collection中国科学院金属研究所
Corresponding AuthorWang Zhongguang
Affiliation1.Chinese Acad Sci, Met Res Inst, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
2.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA
Recommended Citation
GB/T 7714
Zhu Qingsheng,Zhang Li,Wang Zhongguang,et al. Effect of intermetallics Ag3Sn on the tensile property of Sn3.8Ag0.7Cu solder alloy[J]. ACTA METALLURGICA SINICA,2007,43(1):41-46.
APA Zhu Qingsheng,Zhang Li,Wang Zhongguang,Wu Shiding,&Shang Jianku.(2007).Effect of intermetallics Ag3Sn on the tensile property of Sn3.8Ag0.7Cu solder alloy.ACTA METALLURGICA SINICA,43(1),41-46.
MLA Zhu Qingsheng,et al."Effect of intermetallics Ag3Sn on the tensile property of Sn3.8Ag0.7Cu solder alloy".ACTA METALLURGICA SINICA 43.1(2007):41-46.
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