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Microstructure evolution and interfacial healing mechanism of heterogeneous interfaces in Ni-Co based superalloys during hot compression bonding 期刊论文
MATERIALS CHARACTERIZATION, 2025, 卷号: 220, 页码: 13
作者:  Ren, Shaofei;  Xiao, He;  Wu, Shengqing;  Zeng, Chenqi;  Bai, Xiaolong;  Liu, Sheng;  Xu, Bin;  Cui, Chuanyong;  Ma, Guangcai;  Sun, Mingyue
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
Hot compression bonding  Bonding interface  Continuous dynamic recrystallization  Necklace-like recrystallization  Interface healing