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Emerging insights into heterotrimeric G protein signaling in plants 期刊论文
JOURNAL OF GENETICS AND GENOMICS, 2016, 卷号: 43, 期号: 8, 页码: 495-502
作者:  Xu Quan;  Zhao Mingzhu;  Wu Kun;  Fu Xiangdong;  Liu Qian
收藏  |  浏览/下载:129/0  |  提交时间:2021/02/02
GTPASE-ACTIVATING PROTEINS  ALPHA-SUBUNIT GPA1  ARABIDOPSIS-THALIANA  GAMMA-SUBUNIT  BINDING PROTEIN  BETA-SUBUNIT  CELL-PROLIFERATION  COUPLED RECEPTORS  MOLECULAR-CLONING  GRAIN LENGTH  G protein signaling  Non-canonical G gamma subunits  DEP1  GS3  Yield potential  
Effects of grain size and initial immobile dislocation density on fatigue behavior of polycrystalline metals 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2014, 卷号: 590, 页码: 194-198
作者:  J. Xu;  G. P. Zhang
收藏  |  浏览/下载:114/0  |  提交时间:2014/02/19
Grain Size  Dislocation Density  Fatigue  Simulation  Severe Plastic-deformation  Copper Single-crystals  Surface-morphology  Strain Amplitude  Length-scale  Films  Microstructure  Patterns  
On the length scale of cyclic strain localization in fine-grained copper films 期刊论文
Philosophical Magazine Letters, 2010, 卷号: 90, 期号: 1, 页码: 69-76
作者:  B. Zhang;  K. H. Sun;  Y. Liu;  G. P. Zhang
Adobe PDF(1125Kb)  |  收藏  |  浏览/下载:79/0  |  提交时间:2012/04/13
Cyclic Strain Localization  Length Scale  Fine Grain  Metal Film  Fatigue Mechanisms  Damage Behavior  Metals  
Simulation study of effects of initial particle size distribution on dissolution 期刊论文
Acta Materialia, 2009, 卷号: 57, 期号: 2, 页码: 316-325
作者:  G. Wang;  D. S. Xu;  N. Ma;  N. Zhou;  E. J. Payton;  R. Yang;  M. J. Mills;  Y. Wang
Adobe PDF(842Kb)  |  收藏  |  浏览/下载:107/0  |  提交时间:2012/04/13
Kinetics  Dissolution  Modeling  Phase Field Models  Nickel Alloys  Phase-field Model  Increasing Length Scale  Computer-simulation  Grain-growth  Microstructural Evolution  Binary-alloys  Ni-al  Unequal  Conductivities  Ordered Intermetallics  Anisotropic Systems  
Effects of Interface and Grain Boundary on the Electrical Resistivity of Cu/Ta Multilayers 期刊论文
Journal of Materials Science & Technology, Journal of Materials Science & Technology, 2009, 2009, 卷号: 25, 25, 期号: 5, 页码: 699-702, 699-702
作者:  M. Wang;  B. Zhang;  G. P. Zhang;  Q. Y. Yu;  C. S. Liu
Adobe PDF(375Kb)  |  收藏  |  浏览/下载:77/0  |  提交时间:2012/04/13
Electrical Resistivity  Electrical Resistivity  Multilayer  Multilayer  Interface  Interface  Grain Boundary  Grain Boundary  Scattering  Scattering  Length Scale  Length Scale  Thin Copper-films  Thin Copper-films  Polycrystalline Films  Polycrystalline Films  Transport-properties  Transport-properties  External  External  Surfaces  Surfaces  Metallic-films  Metallic-films  Scattering  Scattering  Superlattices  Superlattices  Reflection  Reflection  Dependence  Dependence  Behavior  Behavior